2021
DOI: 10.1002/smll.202105999
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Integrated Porous Cu Host Induced High‐Stable Bidirectional Li Plating/Stripping Behavior for Practical Li Metal Batteries

Abstract: The double‐sided electrodes with active materials are widely used for commercial lithium (Li) ion batteries with a higher energy density. Accordingly, developing an anode current collector that can accommodate the stable and homogeneous Li plating/stripping on both sides will be highly desired for practical Li metal batteries (LMBs). Herein, an integrated bidirectional porous Cu (IBP‐Cu) film with a through‐pore structure is fabricated as Li metal hosts using the powder sintering method. The resultant IBP‐Cu c… Show more

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Cited by 38 publications
(28 citation statements)
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References 63 publications
(50 reference statements)
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“…Powder-sintering is a heat treatment applied to compact powder in order to improve the strength and structure integrity. It is, thought to be a facile, effective, and lowcost way for the preparation of porous materials [26,27]. The particles of the powder chemically bond to each other and form a consistent shape under a high temperature (below the melting point of the main component).…”
Section: D Copper Frameworkmentioning
confidence: 99%
“…Powder-sintering is a heat treatment applied to compact powder in order to improve the strength and structure integrity. It is, thought to be a facile, effective, and lowcost way for the preparation of porous materials [26,27]. The particles of the powder chemically bond to each other and form a consistent shape under a high temperature (below the melting point of the main component).…”
Section: D Copper Frameworkmentioning
confidence: 99%
“…[185] Modification of the current collector is an alternative approach to regulating Li depositing behaviors, especially for anode-free systems. [186] Lin et al proposed an epitaxial induced plating current-collector to enhance the lifespan of anode-free LMBs. [114] The liquid metal coating layer on current collects initially stores Li by alloying reaction, forming an epitaxial layer.…”
Section: Tailoring Host Structuresmentioning
confidence: 99%
“…[47] For Li metal anodes, Li-plating-induced internal stress plays a significant role in Li dendrite growth. [48][49][50][51] Such stress-induced dendrites could be mitigated on soft substrates or non-rigid porous conductive hosts through stress relaxation mechanism. [47,48] But for Zn metal anodes, whether they suffer the similar stress change during Zn plating and its effect on dendrite growth are still not clear.…”
Section: Introductionmentioning
confidence: 99%