2020 IEEE International Electron Devices Meeting (IEDM) 2020
DOI: 10.1109/iedm13553.2020.9372020
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Innovative Smart Cut™ Piezo On Insulator (POI) Substrates for 5G acoustic filters

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Cited by 39 publications
(5 citation statements)
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“…A 4-in single-crystal LiNbO 3 /SiC heterogeneous substrate was fabricated using the ion-slicing technology [42], [43]. First, helium ions (He + ) were implanted into an X-cut LiNbO 3 wafer to form a damaged layer below the surface of the wafer.…”
Section: A Fabrication Process and Measurementsmentioning
confidence: 99%
“…A 4-in single-crystal LiNbO 3 /SiC heterogeneous substrate was fabricated using the ion-slicing technology [42], [43]. First, helium ions (He + ) were implanted into an X-cut LiNbO 3 wafer to form a damaged layer below the surface of the wafer.…”
Section: A Fabrication Process and Measurementsmentioning
confidence: 99%
“…The widely used electrodes and substrates are discussed. Regarding the SAW, insulative substrates are often adopted [144]. Silicon [145,146] and sapphire [147][148][149][150] are the two commonly used substrates.…”
Section: Electrodes and Substratesmentioning
confidence: 99%
“…LN or LT) bonded on a support substrate while having an acoustic reflector in between so that significant acoustic impedance mismatch can be attained. Note that this kind of multilayer structure was only enabled recently thanks to the advancement in micro-fabrication techniques in making piezoelectric single-crystal thin film with precisely controlled thickness by means of smart cutting or mechanical polishing [6,7]. Takai et al reported a multilayer SAW device with LT/SiO 2 /AlN layers on a Si support substrate [8].…”
Section: Introductionmentioning
confidence: 99%