2019
DOI: 10.1039/c9se00019d
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Innovative design of microencapsulated phase change materials for thermal energy storage and versatile applications: a review

Abstract: This review focuses on methodologies, technologies and innovative design of microencapsulated PCMs with a variety of shells for versatile applications.

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Cited by 223 publications
(122 citation statements)
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“…However, microPCMs have some drawbacks such as the low of thermal conductivity, the weakness of mechanical properties, and the easy leakage of PCMs. 8 According to the core-shell structure of microPCMs, the pathway of overcoming the drawbacks is mainly classified into two categories: modifying PCMs core material and modifying shell material. For the PCMs material, the high thermal conductivity particles were added to PCMs, and then the mixture was encapsulated by the shell material.…”
Section: Introductionmentioning
confidence: 99%
“…However, microPCMs have some drawbacks such as the low of thermal conductivity, the weakness of mechanical properties, and the easy leakage of PCMs. 8 According to the core-shell structure of microPCMs, the pathway of overcoming the drawbacks is mainly classified into two categories: modifying PCMs core material and modifying shell material. For the PCMs material, the high thermal conductivity particles were added to PCMs, and then the mixture was encapsulated by the shell material.…”
Section: Introductionmentioning
confidence: 99%
“…Shell materials are mostly made of stable, soft, and odorless polymer materials. The polymer material must be able to form a film on the surface of the core material, and has no reaction with the core material, being chemically compatible (Liu H. et al, 2019).…”
Section: Introductionmentioning
confidence: 99%
“…[7][8][9] In addition, some common polymers shell materials comprise polystyrene, 10 polyurea-formaldehyde resin, 11 melamine-formaldehyde resin, 12 polyurethane, 13 and poly (butyl acrylate). 22 In addition, using inorganic materials to encapsulate PCM has attracted more attention; there have been some reports involving the use of inorganic silica as a wall material for encapsulating PCM. Compared with the polymer shell material, inorganic shell material shows high thermal conductivity, thermal and chemical stability, and mechanical strength.…”
Section: Introductionmentioning
confidence: 99%
“…[19][20][21] All of the above methods can significantly enhance the heat transfer of the microcapsules, but it is necessary to strictly control the proportion of the inorganic components to avoid damaging the mechanical strength and sealing of the inorganic-organic shell. 22 In addition, using inorganic materials to encapsulate PCM has attracted more attention; there have been some reports involving the use of inorganic silica as a wall material for encapsulating PCM. 23,24 Microencapsulated PCM has been successfully prepared using alternative inorganic materials like CaCO 3 , TiO 2 , and graphene.…”
Section: Introductionmentioning
confidence: 99%