Inkjet printing of UHF antennas on corrugated cardboards for packaging applications

Sowade, Enrico; Göthel, Frank; Zichner, Ralf; Baumann, Reinhard R.

doi:10.1016/j.apsusc.2015.01.113

Cited by 20 publications

(15 citation statements)

References 16 publications

(17 reference statements)

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“…Printing technologies are considered as promising approach for the manufacturing of novel flexible and large area electronics. Several different kinds of printed electronic devices have been demonstrated in literature such as resistors 1 2 , antennas 3 4 , capacitors 5 6 , diodes 7 8 , sensors 9 10 , photovoltaic cells 11 12 , displays 13 14 , batteries 15 , and thin-film transistors 16 17 (TFTs). Despite of the huge efforts towards manufacturing process and device performance optimization, there are still rarely examples that show a sustainable and successful transfer to the industry.…”

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confidence: 99%

All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis

Sowade

Ramón

Mitra

et al. 2016

Sci Rep

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We report on the detailed electrical investigation of all-inkjet-printed thin-film transistor (TFT) arrays focusing on TFT failures and their origins. The TFT arrays were manufactured on flexible polymer substrates in ambient condition without the need for cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. Alternative manufacturing processes for electronic devices such as inkjet printing suffer from lower accuracy compared to traditional microelectronic manufacturing methods. Furthermore, usually printing methods do not allow the manufacturing of electronic devices with high yield (high number of functional devices). In general, the manufacturing yield is much lower compared to the established conventional manufacturing methods based on lithography. Thus, the focus of this contribution is set on a comprehensive analysis of defective TFTs printed by inkjet technology. Based on root cause analysis, we present the defects by developing failure categories and discuss the reasons for the defects. This procedure identifies failure origins and allows the optimization of the manufacturing resulting finally to a yield improvement.

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confidence: 99%

All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis

Sowade

Ramón

Mitra

et al. 2016

Sci Rep

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“…An example of a promising technology is the inkjet printing, until recently used only in the printing industry. This non-contact printing technique is a digital technique with a relatively high precision and can be used in the electronic industry both for prototyping and manufacturing microstructures to form contact pads, conducting paths or more complex elements [1][2][3][4][5].The inkjet printing technique requires the use of special liquids called inks which should be true solutions with a low viscosity. These inks should enable one to create conductive paths.…”

Section: Introductionmentioning

confidence: 99%

The Influence of Sintering Conditions on the Inkjet Printed Paths Resistance

Tomaszewski¹,

Wałach²,

Potencki³

et al. 2016

International Journal of Electronics and Telecommunications

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Abstract-The sintering of elements performed with the inkjet printing technique is one of the stages of flexible printed circuit manufacturing process. It is a crucial factor to determining the printed paths conductivity playing often an important role in the printed circuit. In this paper the study of the influence of thermal sintering conditions (temperature, time) on the resistance of paths made with inkjet printing on flexible substrates by using two electrically conductive inks was presented. The results of the investigations show that the sintering temperature is the main factor determining the paths resistance. Therefore, in some applications the sintering temperature higher than the one specified by the ink manufacturer can be used to decrease the paths resistance and to improve some circuit parameters. However, it should be noticed that the effective resistance decrease occurs only up to a certain temperature due to the appearance cracks in the printed paths.

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“…[ 8–11 ] Several kinds of flexible electronics have already been manufactured using the inkjet printing technology, e.g., capacitors, thin‐film transistors (TFTs), resistors, sensors and detectors, radio frequency antennas, photovoltaics, and so on. [ 4,5,7,9–16 ] All these printed applications are clear evidences to validate the implementation of inkjet technology to deposit fundamental layers with electronic properties, i.e., conductors using nanoparticle or particle‐free‐based metallic or polymeric inks, dielectrics by polymer‐based or hybrid inks with embedded nanoparticles and organic semiconductors (SCs). [ 11,12,17,18 ] Although, the printing of these novel materials has always been a big challenge, but due to the continuously evolving market scenario, it has recently become possible to deposit and postprocess (curing/sintering) these materials with high reliability, thereby, satisfying the electrical demands of devices and circuits, e.g., passive device circuit, filter circuit, and photodetectors.…”

Section: Introductionmentioning

confidence: 99%

Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices

et al. 2020

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Herein, the inkjet printing of bioresorbable materials tuned to function as electrode, dielectric, and semiconductor layers is reported, thereby developing multilayered microelectronic devices such as capacitors and thin‐film transistors, potentially applicable to address specific medical needs. Polymers and natural materials, e.g., poly(3,4‐ethylenedioxythiophene)‐poly(styrenesulfonate), shellac, and β‐carotene, indigo inks are implemented using jettable formulations, that are either commercially procured or self‐formulated, designed explicitly to deposit fundamental layers for capacitors and transistors. Several parameters are evaluated and adjusted to precisely define a layer's thickness, topology, and geometry, matching with the properties of a fully biodegradable Ormocere substrate, explicitly developed for the specific biological applications. Furthermore, these parameters support in acquiring the intended electrical properties of layers, i.e., conductivity, insulation, semiconductivity, capacitance, and current versus voltage characteristics. The entire manufacturing process of devices is accomplished on the Ormocere substrate under ambient conditions and below 60 °C. The results exhibit that the electrical characteristics of the printed functional layers and devices show direct influence to the physical geometry of the printed features. A fully printed capacitor demonstrates capacitance of 1 nF cm−2, whereas transistors show p‐type and n‐type characteristics with current 0.18–5 μA and mobility 6 × 10−4–7 × 10−2 cm2 V−1 s−1.

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Inkjet printing of UHF antennas on corrugated cardboards for packaging applications

Cited by 20 publications

References 16 publications

All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis

All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis

The Influence of Sintering Conditions on the Inkjet Printed Paths Resistance

Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices

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