Inkjet-printed copper electrodes using photonic sintering and their application to organic thin-film transistors

Norita, Shohei; Kumaki, Daisuke; Kobayashi, Yu; Sato, Taketomo; Fukuda, Kenjiro; Tokito, Shizuo

doi:10.1016/j.orgel.2015.06.026

Cited by 54 publications

(42 citation statements)

References 22 publications

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“…However, copper inks require high sintering temperatures (above 300 °C) and/or a reductive atmosphere to obtain high conductivities . Photonic sintering using intense pulsed light can address this problem, and also reduces the process time dramatically, from several minutes to less than one second. The irradiation of a xenon flash lamp with a pulse energy of 9 J cm –2 for 0.8 ms enabled low resistivity (7 μΩ cm) in inkjet‐printed Cu electrodes ( Figure a).…”

Section: Methodsmentioning

confidence: 99%

“…Photonic sintering using intense pulsed light can address this problem, and also reduces the process time dramatically, from several minutes to less than one second. The irradiation of a xenon flash lamp with a pulse energy of 9 J cm –2 for 0.8 ms enabled low resistivity (7 μΩ cm) in inkjet‐printed Cu electrodes ( Figure a). Fabricated TFTs with printed Cu source/drain electrodes treated with pentafluorobenzenethiol and a pentacene semiconducting layer exhibited similar mobility (0.13 cm 2 V –1 s –1 ) to those fabricated with printed silver electrodes.…”

Section: Methodsmentioning

confidence: 99%

“…Fabricated TFTs with printed Cu source/drain electrodes treated with pentafluorobenzenethiol and a pentacene semiconducting layer exhibited similar mobility (0.13 cm 2 V –1 s –1 ) to those fabricated with printed silver electrodes. Although there have been relatively few studies on printed TFTs using copper nanoparticle inks, their use with photonic sintering has the potential to become a major process for obtaining printed conductive lines.…”

Section: Methodsmentioning

confidence: 99%

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Recent Progress in the Development of Printed Thin‐Film Transistors and Circuits with High‐Resolution Printing Technology

2016

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Printed electronics enable the fabrication of large‐scale, low‐cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Almost all electronic applications require information processing using logic circuits. Hence, realizing the high‐speed operation of logic circuits is also important for printed devices. This report summarizes recent progress in the development of printed thin‐film transistors (TFTs) and integrated circuits in terms of materials, printing technologies, and applications. The first part of this report gives an overview of the development of functional inks such as semiconductors, electrodes, and dielectrics. The second part discusses high‐resolution printing technologies and strategies to enable high‐resolution patterning. The main focus of this report is on obtaining printed electrodes with high‐resolution patterning and the electrical performance of printed TFTs using such printed electrodes. In the final part, some applications of printed electronics are introduced to exemplify their potential.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

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Recent Progress in the Development of Printed Thin‐Film Transistors and Circuits with High‐Resolution Printing Technology

2016

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“…To address this goal, the electrode fingers should be printed on the substrate directly, instead of being converted from a pre‐prepared thin film indirectly. Therefore, inkjet printing and screen printing are excepted to be both beneficial and applicable to the processing of electrode fingers of a wide range of materials, such as nanocarbon, metals, metal oxides, polymers, graphene, and biomaterials, for the manufacture of microelectrodes of micro‐supercapacitors. Additionally, 3D printing is expected to be the prospective technology for the production of on‐chip micro‐supercapacitors due to the following reasons.…”

Section: Conclusion and Prospectsmentioning

confidence: 99%

Design of Architectures and Materials in In‐Plane Micro‐supercapacitors: Current Status and Future Challenges

et al. 2016

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The rapid development of integrated electronics and the boom in miniaturized and portable devices have increased the demand for miniaturized and on-chip energy storage units. Currently thin-film batteries or microsized batteries are commercially available for miniaturized devices. However, they still suffer from several limitations, such as short lifetime, low power density, and complex architecture, which limit their integration. Supercapacitors can surmount all these limitations. Particularly for micro-supercapacitors with planar architectures, due to their unique design of the in-plane electrode finger arrays, they possess the merits of easy fabrication and integration into on-chip miniaturized electronics. Here, the focus is on the different strategies to design electrode finger arrays and the material engineering of in-plane micro-supercapacitors. It is expected that the advances in micro-supercapacitors with in-plane architectures will offer new opportunities for the miniaturization and integration of energy-storage units for portable devices and on-chip electronics.

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“…During the last two decades, FLA has become a promising technology for printed electronics allowing the high‐temperature sintering of metal nanoparticle inks for the realization of conductive patterns on arbitrary substrates . Applications include the fabrication of current collecting grids for solar cells, metal contacts for organic TFTs, electrodes for multilayer ceramic capacitors, and piezoelectric materials . Also, owing to the rapid processing times, the integration of FLA into a roll‐to‐roll manufacturing line was successfully demonstrated for the mass production of polymer solar cell modules and radio frequency identification (RFID) tags on PET substrates.…”

Section: Flash Lamp Annealingmentioning

confidence: 99%

Recent Progress in Photonic Processing of Metal‐Oxide Transistors

Yarali

Koutsiaki

Faber

et al. 2019

Adv Funct Materials

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(1 of 37)high mobility (µ) (even in amorphous phase), wide bandgap (transparent in the visible range), and the ability to be controllably doped. Importantly, they can be grown into thin films and various nanostructures with different scalable deposition techniques, including vacuum-based methods such as physical vapor deposition (PVD) [7,8] and chemical vapor deposition (CVD) [9] as well as solution-based processes such as spray [10] and spin coating. [11] Moreover, the resulting layers can be easily patterned using standard fabrication procedures and as such can be integrated into state-of-the-art processes for (opto)electronic applications. The above-mentioned capabilities have led to a plethora of applications such as switching backplanes for displays, transparent and flexible electronics, integrated circuits (ICs), photovoltaics (PVs), organic light-emitting diodes (OLEDs), capacitors, batteries, photocatalytic devices, electrochromics and memory devices, to name but a few. [8,[12][13][14] Because of their ability to be doped, their electronic properties can be tuned from dielectrics to semiconductors and conductors. This characteristic versatility has recently been exploited to stretch the range of their applications to new technological sectors, such as plasmonics in the near infrared and midinfrared spectral ranges. [12,15] One of the driving applications of metal oxides is in thinfilm transistors (TFTs) for large area electronics such as current driven optical displays and ICs. Following the early demonstrations, [16] most effort focused on the fabrication and processing of metal oxides TFTs paying particular attention to the device performance and applications. [1,5,6,17] Especially when processed over large areas, as in the case for display applications, the complexity to precisely control the device reliability and reproducibility becomes a challenging aspect of any TFT technology. To that respect, solution-based techniques progressed rapidly due to their lower cost and higher throughput compared to vacuum-based techniques. In both cases, the metal-oxide deposition has so far been limited to high processing temperatures (>250 °C) (Figure 1a) which renders the technology incompatible with inexpensive, temperature-sensitive substrates such as polymers, the material class of choice for various high throughput manufacturing techniques such as roll-to-roll (R2R) and sheet-to-sheet (S2S)Over the past few decades, significant progress has been made in the field of photonic processing of electronic materials using a variety of light sources. Several of these technologies have now been exploited in conjunction with emerging electronic materials as alternatives to conventional hightemperature thermal annealing, offering rapid manufacturing times and compatibility with temperature-sensitive substrate materials among other potential advantages. Herein, recent advances in photonic processing paradigms of metal-oxide thin-film transistors (TFTs) are presented with particular emphasis on the use of various light sour...

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Inkjet-printed copper electrodes using photonic sintering and their application to organic thin-film transistors

Cited by 54 publications

References 22 publications

Recent Progress in the Development of Printed Thin‐Film Transistors and Circuits with High‐Resolution Printing Technology

Recent Progress in the Development of Printed Thin‐Film Transistors and Circuits with High‐Resolution Printing Technology

Design of Architectures and Materials in In‐Plane Micro‐supercapacitors: Current Status and Future Challenges

Recent Progress in Photonic Processing of Metal‐Oxide Transistors

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