2020
DOI: 10.1002/pssa.202000332
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Informative Aspects of Molten KOH Etch Pits Formed at Basal Plane Dislocations on the Surface of 4H‐SiC

Abstract: Despite being a destructive technique, molten KOH etch pits at basal plane dislocations are found to have informative aspects, as revealed by photoluminescence imaging and optical microscopy, on the 4° off‐cut (0001) surface of 4H‐SiC p–i–n diode chips, where single Shockley‐type stacking faults have expanded during electroluminescence experiments. Smaller etch pits are observed aligning on single lines along ±[100] that are the shallowest sides of stacking faults. Through closer observation of the pits, the f… Show more

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Cited by 8 publications
(4 citation statements)
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“…The governing driving force that bent the BPD can be attributed to the image force acting on the step surface. 16,47) On the right side of the substrate/epilayer interface in Fig. 2, the lower PD line was gradually bent toward the [1120] direction.…”
Section: Discussionmentioning
confidence: 99%
“…The governing driving force that bent the BPD can be attributed to the image force acting on the step surface. 16,47) On the right side of the substrate/epilayer interface in Fig. 2, the lower PD line was gradually bent toward the [1120] direction.…”
Section: Discussionmentioning
confidence: 99%
“…3(b), indicating that the remaining PD lines are along the Peierls valley, namely, the ±[ 2110] and ±[ 12 10] directions. The zigzag structure of the KOH etch pits was observed on the terminating line of the triangular 1SSF that corresponds to 30°Si(g) and 90°Si(g) PDs, 33) where the direction of the etch pits formed on the 90°S i(g) PDs was not symmetric with the 30°Si(g) PDs. However, the zigzag shape observed in Fig.…”
Section: Surface Sidementioning
confidence: 99%
“…The average size of the etch pits of TSDs is about two times larger than that of TEDs [107,108]. The preferential etching of BPDs in off-axis sliced 4H-SiC starts at the outcrop at the surface, and proceeds along the dislocation line of a BPD, which creates the sea-shell shaped etch pit [109,110]. In order to increase the shape difference among etch pits of different dislocations, additives, such as NaOH, K 2 CO 3 , Na 2 O 2 and MgO, have been added into molten KOH to facilitate the identification and statistics of different dislocations in 4H-SiC [111][112][113].…”
Section: Etch Pits Of Dislocations In 4h-sic Wafersmentioning
confidence: 99%