2020
DOI: 10.1016/j.jmst.2019.12.031
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Influence of secondary phases of AlSi9Cu3 alloy on the plasma electrolytic oxidation coating formation process

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Cited by 36 publications
(15 citation statements)
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“…When Cu content in the Al substrate exceeded solubility limit (4.5%), Cu precipitated in the form of intermetallic Al 2 Cu [24]. Size and shape of Al 2 Cu are similar to that exhibited in literature [20]. Microarc discharge occurred preferentially on the α-Al substrate surrounding θ phase (Al 2 Cu).…”
Section: Measurement Of Mechanical Properties and Wear Resistancesupporting
confidence: 78%
See 1 more Smart Citation
“…When Cu content in the Al substrate exceeded solubility limit (4.5%), Cu precipitated in the form of intermetallic Al 2 Cu [24]. Size and shape of Al 2 Cu are similar to that exhibited in literature [20]. Microarc discharge occurred preferentially on the α-Al substrate surrounding θ phase (Al 2 Cu).…”
Section: Measurement Of Mechanical Properties and Wear Resistancesupporting
confidence: 78%
“…Effect of the Cu content on thin coating formation was not explored. At short oxidation times of 15–480 s, Wu et al [20] reported that initial micropores appeared preferentially adjacent to intermetallic Al 2 Cu, and then intermetallic Al 2 Cu was dissolved. Moreover, large size pores were found at overlapping region of Al 2 Cu and β -Al 5 FeSi intermetallics.…”
Section: Introductionmentioning
confidence: 99%
“…6 ), the surrounding Al matrix is quickly oxidized and the formed oxide layer fully covers most of nearby small Si particles. Considering Fe–Mn precipitates, according to Wang et al 42 , the presence of Fe produces residual defects in the native oxide layer providing a path for the penetration of electrolyte, and thus causing the formation of more porous coatings and reducing the growth rate of the coating, due to a reduction in the oxidation efficiency. For these reasons, the coatings obtained on the as printed and annealed samples, characterized by a uniform and finely distributed silicon and by the absence of Fe–Mn precipitates, resulted thicker and denser.…”
Section: Resultsmentioning
confidence: 99%
“… 41 found that a reduction in the size of the eutectic Si causes the formation of a thicker PEO layer; Wu et al . 42 found that the coating is characterized by large micropores on iron-rich precipitates and it is thin with small micropores on eutectic Si. As previously described, samples produced by L-PBF are characterized by a unique microstructure that can be significantly modified, in particular regarding Si distribution, through common heat treatments such as solution treatment and annealing.…”
Section: Introductionmentioning
confidence: 99%
“…Copper is one of the most used biocides exhibiting excellent antibacterial and antifouling properties [3,15] in a wide range of surface materials, and it can also be employed in PEO coatings. The common strategies to incorporate copper species into the oxide layer of the PEO coating are using Al-Cu alloys as the metal precursor substrate [16][17][18][19][20] or adding copper species into the electrolyte during the anodization [3,15,21]. On the other hand, when the purpose is to fabricate a heterojunctioned material, a copper plating procedure can be performed after the anodization [22], forming a metallic layer over the oxide coating.…”
Section: Introductionmentioning
confidence: 99%