Influence of pattern density in nanoimprint lithography

Abstract

Articles you may be interested inViscosity measurement of nanoimprint lithography resists with a rheological nanoindenter Effect of fluoroalkyl substituents on the reactions of alkylchlorosilanes with mold surfaces for nanoimprint lithography J.Polymer selection and critical dimension control across the wafer are key parameters for the nanoimprint lithography technique. This nanotechnology requires polymers having a low glass transition temperature T g combined with a good etch resistance. In this work, three different polymers have been evaluated. The influence of the temperature and pressing time is analyzed to clarify the correlation between polymer behavior and printing uniformity as a function of the pattern density. Measurements of the polymer residual thickness show that the printing uniformity is strongly correlated with the thermal properties of the polymer.

Simulations of nonuniform embossing: The effect of asymmetric neighbor cavities on polymer flow during nanoimprint lithography

“…Viscous polymer flow over large areas limits full replication and uniformity of residual layer thickness as incomplete filling and tool warping result due to non-uniform deformation. Simultaneous replication of combined features having significantly different sizes requires long imprint times compared to uniform fields [11][12][13]15].…”

“…A few groups have studied large-scale flow field effects with non-uniform embossing tools [11][12][13][14], noting limitations in simultaneous replication of patterns having large and small features in close proximity. Correlation and crosstalk of stress and flow fields of simple geometries arises when a single embossing tool contains multiple, non-uniform feature geometries.…”

Solvent-assisted polymer micro-molding

“…Gourgon et al [64] studied the influence of pattern density in nanoimprint lithography. In the preliminary stage of the impringting, the mold engraved uniformly into the resist film, and the polymer was evacuated first along the sidewalls of the mold features in all the structures (Figure 12(a)).…”

Residual Layer Self‐Removal in Imprint Lithography

“…The problem is exacerbated when there are residual layer variations across the imprint field. [5,6] Variations in the thickness of the residual layer are typically found when solid film resists are imprinted with a mold that contains variations in feature density. In the presence of uneven residual layers, an accelerated lateral trimming occurs where the RIE breaks through the thinnest residual layer regions first.…”