2005
DOI: 10.4164/sptj.42.244
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Influence of Glass Particle Property for Glass-ceramics Layer upon Sintering of the Sandwich Substrate with Inner-constraining Particles Layer

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Cited by 7 publications
(3 citation statements)
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“…24) For other liquid phase sintering materials, such as cermet (WC Co and TiCNi), ceramics and glass mixed phase materials (Al 2 O 3 and Si 3 N 4 ), the liquid phase sintering is the most basic liquid phase sintering. 4,25) The simulation results also show that reducing £ SL improves the wettability to the solid phase, facilitates rearrangement, and increases the relative density, which is consistent with the real materials. It is difficult to experimentally change only £ SL independently, and it is difficult to analyze the influence of only one factor expected, so it is advantageous to analyze this point by simulation.…”
Section: Discussionsupporting
confidence: 76%
“…24) For other liquid phase sintering materials, such as cermet (WC Co and TiCNi), ceramics and glass mixed phase materials (Al 2 O 3 and Si 3 N 4 ), the liquid phase sintering is the most basic liquid phase sintering. 4,25) The simulation results also show that reducing £ SL improves the wettability to the solid phase, facilitates rearrangement, and increases the relative density, which is consistent with the real materials. It is difficult to experimentally change only £ SL independently, and it is difficult to analyze the influence of only one factor expected, so it is advantageous to analyze this point by simulation.…”
Section: Discussionsupporting
confidence: 76%
“…[1][2][3][4][5] LTCCs are used as a small passive component that is co-firable with a wiring conductor with a high conductivity, such as Cu, Ag, or Au, by lowering the sintering temperature of the ceramic used as the insulating layer. [6][7][8][9][10][11][12][13][14][15][16] LTCCs have a very small dielectric loss, which affects the high-frequency properties, when compared with organic resin generally used as insulating materials in electronic circuits. 17) Therefore, LTCCs are suitable materials for constructing filters.…”
Section: Introductionmentioning
confidence: 99%
“…There are three main processes involved in nonshrinkage (in the x – y direction) sintering technology for LTCC, 6–10 that is, self‐constrained sintering, pressureless constrained sintering, and pressure‐assisted constrained sintering. Although the conventional free sintering process is cost effective, the variation in the dimensions of the fired circuit design and its dimensional tolerances are large.…”
Section: Introductionmentioning
confidence: 99%