Influence of deposited metal structures on the failure mechanisms of silicon-based components

Deluca, Marco; Bermejo, Raúl; Pletz, Martin; Wießner, Manfred; Supancic, Peter; Dänzer, Robert

doi:10.1016/j.jeurceramsoc.2012.06.027

Cited by 14 publications

(4 citation statements)

References 41 publications

(48 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Small possible deviations of Poisson's ration due to crystal anisotropy were thereby neglected. For the testing conditions in this work a value of f ~2.0 was used, as calculated in Refs . Weibull analysis of the obtained failure stresses was performed on each sample according to the EN‐843‐5 standard .…”

Section: Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Understanding the effect of surface flaws on the strength distribution of brittle single crystals

et al. 2018

Self Cite

View full text Add to dashboard Cite

The dependence of strength on the surface quality of brittle single crystals is highly relevant in microelectronic applications, where a certain roughening of the crystal surface is required to guarantee or enhance the functional properties of the final component. In this work, the effect of surface conditioning on the strength distribution of single crystals is assessed on LiTaO3 and LiNbO3 samples with distinct surfaces (i.e., polished, grinded, and scratched). Artificial surface cracks (scratches) were introduced using a Berkovich nanoindenter tip oriented under various angles with respect to the most critical {01true1false¯2} cleavage plane. Biaxial tensile tests were performed using the ball‐on‐three‐balls test, supported by fractographic analyses to interpret the strength results. A direct correlation between sub‐surface damage and strength was observed, associated with the hardness and elastic constants of the material, being strongly dependent on the crystal orientation with respect to the loading axis. Furthermore, we provide an explanation for the usually low Weibull modulus in single crystals and discuss the validity of the biaxial tests on scratched specimens for fracture toughness evaluation.

show abstract

Section: Methodsmentioning

confidence: 99%

“…For the testing conditions in this work a value of f~2.0 was used, as calculated in Refs. 12,31 Weibull analysis of the obtained failure stresses was performed on each sample according to the EN-843-5 standard. 32 A minimum of 15 specimens per sample (scratched specimens) was selected to guarantee statistical significant results.…”

Section: Mechanical Testingmentioning

confidence: 99%

Understanding the effect of surface flaws on the strength distribution of brittle single crystals

et al. 2018

Self Cite

View full text Add to dashboard Cite

show abstract

“…[16][17][18][19] To the best of our knowledge, until now there have been no reports on chemical structure analysis of the surface and the interface of multilayer metal films under UV radiation and scientific judgment for their failure mechanism. [20][21][22][23] Therefore it is essential to improve or develop the new multilayer thin films in order to establish a suitable estimation method which performs early diagnosis of the changes in the interface structure of electrode films. 9,15 Actually, the advanced surface analysis tools, such as Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), can provide valuable data for changes in structure of the surface and the interface.…”

Section: Introductionmentioning

confidence: 99%

Electron migration behavior of Au/Cu multilayer films on Si substrates under UV radiation

Kai

Yao

Cao

et al. 2015

Phys. Chem. Chem. Phys.

View full text Add to dashboard Cite

Au/Cu multilayer films were plated by the magnetron sputtering method on p-Si(100) substrates. The sample temperature was changed from room temperature to 44 °C under UV radiation in a vacuum within 120 minutes, and then remained stable with treatment time increased. Meanwhile, the surface roughness was changed from 4.2 nm to 5.9 nm and then also remained stable. But the interface width of Au/Cu still continued to increase during that steady stage. The calculation results show that the concentration gradient of Cu atoms fell to 2.24 in 360 minutes from 3.45 at the beginning. The increase of defects in the grain boundaries of the Au layer was induced by UV radiation, because the Cu element had a smaller work function relative to the Au element and it was more likely to migrate to the surface layer through the grain boundaries of the Au layer.

show abstract

“…In previous works the failure of typical 2 x 2 x 0.12 mm 3 silicon chips was analyzed and the mechanical resistance (strength) determined under biaxial bending [3,4,5]. The fracture loads for such geometry ranged from 5 N to 20 N for a loading configuration (i.e.…”

Section: Introductionmentioning

confidence: 99%

Multi-physics simulation of the component attachment within embedding process

Macurova

Kharicha

Pletz

et al. 2013

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

View full text Add to dashboard Cite

With the trend towards increasing complexity of Printed Circuit Boards (PCB), there has been considerable interest of investigation of the embedding process. The main focus has been set on the first step, the chip attachment by using an adhesive. Investigation of the adhesive thickness underneath the component by a numerical and an analytical model has been provided. The numerical model was produced with commercial program Ansys FLUENT. The results of both models are compared with experimental data to validate the models.

show abstract

Influence of deposited metal structures on the failure mechanisms of silicon-based components

Cited by 14 publications

References 41 publications

Understanding the effect of surface flaws on the strength distribution of brittle single crystals

Understanding the effect of surface flaws on the strength distribution of brittle single crystals

Electron migration behavior of Au/Cu multilayer films on Si substrates under UV radiation

Multi-physics simulation of the component attachment within embedding process

Contact Info

Product

Resources

About