Industrial femtosecond lasers for machining of heat-sensitive polymers (Conference Presentation)

Single-shot ultrafast laser processing of high-aspect-ratio nanochannels using elliptical Bessel beams

“…In this context, a new processing technology of transparent materials known as stealth machining is currently showing great promise because, rather than using ultrashort pulses for direct material ablation, infrared pulses are used to create an internal damage plane allowing cleaving without debris generation [3]. In previous work, the damage plane was generated through laser-induced defects of ∼5-10 m that induce internal cracks whose orientation could be controlled with elliptical beam shaping [4,5].…”

“…The principle of stealth nanomachining is to combine the generation of such extended damage regions with high-speed scanning to induce a weakened plane within the material. When followed by the application of a weak applied mechanical stress, the material cleaves naturally along this plane resulting in material separation without material loss or deleterious debris [3,5,[7][8][9], in contrast with a conventional ablative process.…”

Solid-state femtosecond UV lasers: recent advances and challenges

“…This allows more precise material ablation with outstanding resolution and quality with minimal heat-affected zone (HAZ) [1]. For instance, machining heat-sensitive polymers using femtosecond UV laser shows superior results [2,3]. The ability to cut heat-sensitive polymers with minimum kerf width, low HAZ, and at high speeds is critical for OLED and other consumer electronics industries [4].…”