2017
DOI: 10.1016/j.snb.2017.05.057
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In vitro and in vivo biostability assessment of chronically-implanted Parylene C neural sensors

Abstract: Parylene C has rapidly gained attention as a exible biomaterial for a new generation of chronic neural probes. However, polymeric material failure in the form of delamination, swelling or tearing, often compromises device biostability in the long term. This work constitutes a rst step towards lifetime assessment of Parylene C implanted devices. We have conceived a Parylene C-based neural probe with PEDOT-nanostructured gold electrodes for the recording of brain activity. The material response to its biological… Show more

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Cited by 62 publications
(63 citation statements)
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“…Successful strategies for active electrode durability include promoting polymer‐substrate adhesion with nanostructured platinum and iridium oxide . For recording, only a small number of studies to date have explored the stability of PEDOT:PSS for more than a few weeks . Generally, stable impedances or marginal increases (<10%) have been reported in vitro in buffered saline solutions (phosphate buffered saline or artificial cerebro‐spinal fluid) for PEDOT:PSS coatings that were deposited on metal electrodes using electrochemical polymerization .…”
mentioning
confidence: 99%
“…Successful strategies for active electrode durability include promoting polymer‐substrate adhesion with nanostructured platinum and iridium oxide . For recording, only a small number of studies to date have explored the stability of PEDOT:PSS for more than a few weeks . Generally, stable impedances or marginal increases (<10%) have been reported in vitro in buffered saline solutions (phosphate buffered saline or artificial cerebro‐spinal fluid) for PEDOT:PSS coatings that were deposited on metal electrodes using electrochemical polymerization .…”
mentioning
confidence: 99%
“…For high bond yield, alignment between the substrates is important and in the case of building a custom jig or adapting an existing flip chip bonder, the levelness and thermo-mechanical properties of the bond head are critical. In this way, ACF can be successfully used for electrical packaging to Parylene devices including ASIC integration ( Figure 10 ) [ 85 , 86 , 87 , 88 ]. In unpublished results, we achieved large-area packaging of Parylene electronics with pitch and width of contacts down to (100 µm pitch) using ACF (Dexerials CP13341-18AA, Dexerials, Tokyo, Japan).…”
Section: Challengesmentioning
confidence: 99%
“…These conditions point toward the direction of polymer materials. Polydimethylsiloxane (PDMS), PI, and parylene(s) are being explored by a large amount of researchers for these purposes [7][8][9][10]. Despite the biocompatibility and good mechanical properties, one major disadvantage of these polymers for encapsulation is their low hermeticity towards moisture and water [11,12].…”
Section: Introductionmentioning
confidence: 99%