Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements

Yu, Dingfeng; Zhao, Jie; Wang, Li

doi:10.1016/j.jallcom.2004.01.012

Cited by 197 publications

(117 citation statements)

References 10 publications

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“…1 The new lead-free solders are mostly Sn-containing binary and ternary alloys. 2 Due to their better thermomechanical properties, SAC alloys are considered as the best choice. 2,3 However, because of their coarse microstructure, iron (Fe), cobalt (Co), and nickel (Ni) have been used as refining elements, and their effects on the microstructure have been investigated.…”

Section: Introductionmentioning

confidence: 99%

“…2 Due to their better thermomechanical properties, SAC alloys are considered as the best choice. 2,3 However, because of their coarse microstructure, iron (Fe), cobalt (Co), and nickel (Ni) have been used as refining elements, and their effects on the microstructure have been investigated. 4 Many combinations of, e.g., indium (In), antimony (Sb), bismuth (Bi), copper (Cu), and silver (Ag) are also used as alloying elements.…”

Section: Introductionmentioning

confidence: 99%

“…4 Many combinations of, e.g., indium (In), antimony (Sb), bismuth (Bi), copper (Cu), and silver (Ag) are also used as alloying elements. 2 Extensive knowledge and understanding of the mechanical behavior of the emerging generation of lead-free solders is required to satisfy the demands of structural reliability.…”

Section: Introductionmentioning

confidence: 99%

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Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

Sadiq

Pesci

Cherkaoui

2013

Journal of Elec Materi

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. An extensive study is made to analyze the impact of pure lanthanum on the microstructure and mechanical properties of Sn-Ag-Cu (SAC) alloys at high temperatures. Different compositions are tested; the temperature applied for the isothermal aging is 150°C, and aging times of 10 h, 25 h, 50 h, 100 h, and 200 h are studied. Optical microscopy with cross-polarized light is used to follow the grain size, which is refined from 8 mm to 1 mm for as-cast samples and is maintained during thermal aging. Intermetallic compounds (IMCs) present inside the bulk Sn matrix affect the mechanical properties of the SAC alloys. Due to high-temperature exposure, these IMCs grow and hence their impact on mechanical properties becomes more significant. This growth is followed by scanning electron microscopy, and energy-dispersive spectroscopy is used for elemental mapping of each phase. A significant refinement in the average size of IMCs of up to 40% is identified for the as-cast samples, and the coarsening rate of these IMCs is slowed by up to 70% with no change in the interparticle spacing. Yield stress and tensile strength are determined through tensile testing at 20°C for as-cast samples and after thermal aging at 150°C for 100 h and 200 h. Both yield stress and tensile strength are increased by up to 20% by minute lanthanum doping.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

Sadiq

Pesci

Cherkaoui

2013

Journal of Elec Materi

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“…The samples were connected only using paste P1 at the soldering pad locations. These samples are denoted as PCB-T/Cu, PCB-T/Cu-Ni-Au, PCB-T/Cu-Sn, and PCB-T/Cu-Sn 99 Cu 1 .…”

Section: Methodsmentioning

confidence: 99%

“…Pb-free solders are mostly Sn-containing binary and ternary alloys. 1 A special class is formed by eutectic alloys of Sn with noble metals such as Ag and Cu. Eutectic alloys are used as solders because they have a single, low melting point.…”

Section: Introductionmentioning

confidence: 99%

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Rudajevová

Dusek

2014

Journal of Elec Materi

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Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn 62.5 Pb 36.5 Ag 1 and Sn 96.5 Ag 3 Cu 0.5 , were used for preparation of electronic joints. Various combinations of these solders and soldering pads with different surface finishes such as Cu, Cu-Ni-Au, Cu-Sn, and Cu-Sn 99 Cu 1 were used. During melting of both pastes, the Sn and Sn 99 Cu 1 surface finishes immediately dissolved in the solder and the Cu surface coating was exposed to the melt. Therefore, practically the same undercooling was found for the Cu, Cu-Sn, and Cu-Sn 99 Cu 1 coatings. The lowest undercooling was found for the Cu-Ni-Au surface finish for both solder pastes. If two separated electronic joints were made on the sample, two separate peaks were found in the DSC signal during solidification. In the sample with only one joint, only one exothermic peak was found. These findings were observed for all paste/surface finish combinations. These data were analyzed, showing that this effect is a consequence of undercooling and recalescence: Latent heat released during solidification of the joint increases the surrounding temperature and influences all the processes taking place.

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‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

Kang¹

2012

Lead‐Free Solders: Materials Reliability for Electronics

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Since July, 2006, following the EUs RoHS legislation, the consumer electronics industry has been offering 'green' products by eliminating Pb-containing solders and other toxic materials. This transition has been relatively smooth, because the reliability requirements are less stringent. However, the Pb-free transition for high-performance electronic systems (such as servers and telecommunication) is still on-going due to their rigorous reliability requirements. For example, the research and development efforts to implement Pb-free flipchip interconnections for high-end applications are still very active.In this chapter, the recent progress in Pb-free solder development, especially minor alloy additions to Sn-rich solders is reviewed in light of improving various physical, mechanical, metallurgical or electrical properties of solder joints. The topics to be discussed include those such as control of undercooling, microstructure, interfacial reactions, or void formation, as well as enhancing impact resistance, electromigration, and other mechanical properties.

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Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements

Cited by 197 publications

References 10 publications

Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

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