Improvement of Thickness Uniformity of Bulk Silicon Wafer by Numerically Controlled Local Wet Etching

Abstract

We have developed numerically controlled local wet etching (NC-LWE) as a novel deterministic subaperture figuring and finishing technique, which is suitable for fabricating various optical components and finishing functional materials. In this technique, a chemical reaction between the etchant and the surface of the workpiece removes the surface without causing the degradation of the physical properties of the workpiece material. Furthermore, the processing properties of NC-LWE are insensitive to external dist…