2020
DOI: 10.1016/j.polymertesting.2020.106502
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Improvement of electrical and material properties of epoxy resin/ aluminum nitride nanocomposites for packaging materials

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Cited by 38 publications
(39 citation statements)
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“…An increase of cross-linking density in the epoxy network, confirmed by an increase in the glass transition temperature, has been observed for nanocomposites containing aluminum hypophosphite nanoparticles (increase in T g greater than 8%) [ 78 ]. Increases in T g have also been reported for epoxy-based nanocomposites containing epoxy-grafted silica (up to 5–6% at a filler content of 2.5 wt.%) [ 66 ] and nano-aluminum nitride (around 13% by adding 1 wt.% of nano-AlN) [ 89 ]. On the other hand, decreases in T g have been found upon the incorporation of nano-Al 2 O 3 particles (greater than 10 °C) at a 0.1 wt.% loading [ 54 ]; more limited reductions in T g (up to 3 °C) have been measured upon addition of boehmite nanoparticles at low concentration levels (i.e., 1 wt.%) [ 85 ].…”
Section: Curing/cross-linking Processmentioning
confidence: 91%
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“…An increase of cross-linking density in the epoxy network, confirmed by an increase in the glass transition temperature, has been observed for nanocomposites containing aluminum hypophosphite nanoparticles (increase in T g greater than 8%) [ 78 ]. Increases in T g have also been reported for epoxy-based nanocomposites containing epoxy-grafted silica (up to 5–6% at a filler content of 2.5 wt.%) [ 66 ] and nano-aluminum nitride (around 13% by adding 1 wt.% of nano-AlN) [ 89 ]. On the other hand, decreases in T g have been found upon the incorporation of nano-Al 2 O 3 particles (greater than 10 °C) at a 0.1 wt.% loading [ 54 ]; more limited reductions in T g (up to 3 °C) have been measured upon addition of boehmite nanoparticles at low concentration levels (i.e., 1 wt.%) [ 85 ].…”
Section: Curing/cross-linking Processmentioning
confidence: 91%
“…Aluminum nitride (AlN) spherical nanoparticles (average diameter of 50 nm) were added to epoxy resin in the view to enhance its electrical properties; these nanocomposites display, additionally, a greater thermal resistance [ 89 ].…”
Section: Nanofillers For Epoxy Resinsmentioning
confidence: 99%
“…The measurement error of the thermal conductivity for these samples is 0.002, 0.007, 0.006, 0.001, and 0.0004 W/mK, respectively. Compared to the thermal conductivity of the pure EP (0.22 W/mK) in the previous work, 30 the enhancement rate of the micro and micro‐nano hybrid composites is 205%, 247.7%, 235%, 319.1%, and 329.5%, respectively. The results show that the thermal conductivity of the epoxy resin is evidently increased with the addition of the micro and nano‐AlN fillers.…”
Section: Resultsmentioning
confidence: 61%
“…The E‐51 bisphenol is adopted as the EP matrix in the present study 30 . The curing agent is methyl hexahydrophthalic anhydride (MHHPA) and the accelerator is Tris (dimethylamino methyl) phenol (DMP‐30).…”
Section: Methodsmentioning
confidence: 99%
“… 15 18 It has been reported that the mechanism by which low content nanofillers (such as TiO 2 , 19 , 20 MgO, 21 , 22 and Al 2 O 3 23 , 24 ) can improve the breakdown strength of polymer is mainly attributed to two ways: (1) the tortuous path of electron breakdown caused by nanofillers. 25 , 26 (2) Nanofillers capture electrons by introducing deep traps into the polymer ( Figure 1 b). It has been revealed that nano-SiO 2 can effectively improve the electrical insulation properties of polymers.…”
Section: Introductionmentioning
confidence: 99%