Improved thermal conductivity and electromechanical properties of natural rubber by constructing Al2O3-PDA-Ag hybrid nanoparticles

3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites

“…The method of adding fillers is a fast way to improve the thermal conductivity of polymers. Metal materials (such as copper powder [ 7 , 8 , 9 ], silver powder [ 10 , 11 ], metal sheet and wire [ 12 , 13 , 14 ]), carbon materials (such as carbon fiber (CF) [ 15 , 16 , 17 ], graphene material [ 18 , 19 ], graphite material [ 20 , 21 ], carbon nanotubes [ 22 , 23 ], carbon black [ 24 , 25 ]), inorganic fillers (such as aluminum nitride [ 26 , 27 ], boron nitride [ 28 , 29 , 30 ], silicon nitride [ 31 , 32 ], silicon carbide [ 33 ], alumina [ 34 , 35 ]) and other high thermal conductivity fillers are often used to improve the thermal conductivity of polymers. When the particulate filler content is small, it is difficult to significantly improve the thermal conductivity of the matrix.…”

Dielectric, thermally conductive, and heat-resistant polyimide composite film filled with silver nanoparticle-modified hexagonal boron nitride

“…In addition, the surface AgNPs present high TC and the phonons could be transmitted to adjacent particles using the AgNPs as bridges to increase the number of heat flow transmission paths. 15,24 To evaluate the thermal resistance of the PI composites after modification more effectively, we calculated the thermal resistances of each simple by dividing the sample thickness by its TC. The thermal resistances of the h-BN/PI composite films with the filler contents of 7 and 10 wt% were 82.7 × 10 −5 and 59.7 × 10 −5 (m 2 ·K) W −1 , respectively.…”

“…The dielectric permittivity gradually decreased with increasing frequency. Because the frequency of the electric field changed too quickly, 15 the changes in interfacial (Maxwell–Wagner–Sillars effect) and dipole-orientated polarization were delayed. When analyzed at the same frequency, the h-BN@Ag/PI composite film with the filler content of 4 wt% presented the largest dielectric permittivity of all analyzed composite films.…”

“…However, leakage currents and interface polarization losses increase the dielectric permittivity and dielectric loss of composite films, and that lowers the signal transmission speed. Inorganic insulating and thermally conductive nanoparticles, such as hexagonal boron nitride (h-BN), 14 aluminum oxide, 15 and aluminum nitride, 9 can be added to polymers to improve their TC. Among them, h-BN, termed as "white graphene," which presents an in-plane TC of 200 W (mÁK) À1 , excellent thermal stability, and remarkable electrical insulating properties owing to its wide band gap of 5-6 eV, 5,8,16 is an ideal candidate for improving the TC, dielectric permittivity, and dielectric loss of PI composite films.…”

Polydopamine-Modified Al2O3/Polyurethane Composites with Largely Improved Thermal and Mechanical Properties

“…Therefore, the results showed that the prepared PDA-coated alumina can simultaneously improve both the mechanical properties and thermal conductivity of PU. ceramic fillers, spherical Al 2 O 3 has often been used as electronic packaging materials because it exhibits higher thermal conductivity (32 W/m K), easier surface modification, wider source, higher load, lower viscosity, better fluidity, and excellent insulation performance [19,20]. Alumina as a thermal conductivity filler to enhance the thermal conductivity of polymers has been widely examined by many researchers [21][22][23].In general, the high thermal conductivity of polymer composites mainly depends on whether the filler has a good thermal conduction path or network, which is mainly related to the interfacial interaction and dispersion of the filler in polymers matrix [7,[24][25][26].…”