2019
DOI: 10.1002/pssa.201900518
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Improved Surface Passivation by Wet Texturing, Ozone‐Based Cleaning, and Plasma‐Enhanced Chemical Vapor Deposition Processes for High‐Efficiency Silicon Heterojunction Solar Cells

Abstract: Silicon heterojunction (SHJ) solar cells rely on excellent surface passivation of the crystalline wafer. This article reports on the development of wet chemical processes varying the texturing and optimizations of the final clean processes for Czochralski–silicon wafers used in SHJ solar cells. Three different additives are used to modify both the pyramid size and the texture homogeneity on the wafers. As an alternative to standard Radio Corporation of America (RCA) sequence, ozonized deionized (DI) water‐base… Show more

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Cited by 16 publications
(14 citation statements)
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References 22 publications
(34 reference statements)
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“…This approach shows a new path to achieving high V OC values on LPC‐Si and will be the subject of future work. For more information, the reader is referred to a recent publication by Morales‐Vilches et al., in which V OC values of 740 mV have been demonstrated on small (4 cm 2 ) and full‐area (244 cm 2 ) cells on monocrystalline Czochralski silicon (CZ‐Si) wafers with silicon heterojunction architecture …”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…This approach shows a new path to achieving high V OC values on LPC‐Si and will be the subject of future work. For more information, the reader is referred to a recent publication by Morales‐Vilches et al., in which V OC values of 740 mV have been demonstrated on small (4 cm 2 ) and full‐area (244 cm 2 ) cells on monocrystalline Czochralski silicon (CZ‐Si) wafers with silicon heterojunction architecture …”
Section: Resultsmentioning
confidence: 99%
“…Further improvements in V OC can still be expected with improved a‐Si:H contact layers and reduced recombination at crystallographic defects . In particular, the approach of depositing three very thin layers of a‐Si(i), each with a short hydrogen plasma treatment, will be optimized for LPC‐Si as it has demonstrated V OC values of 740 mV on CZ‐Si wafers …”
Section: Resultsmentioning
confidence: 99%
“…have to be tuned to enhance SiH 3 radical formation in the plasma. In addition to these plasma processing conditions, in situ hydrogen plasma treatment (HPT), [ 17 ] postannealing, [ 18 ] and a multilayer approach [ 19–21 ] have been exploited to enhance the chemical passivation.…”
Section: Introductionmentioning
confidence: 99%
“…12,13 In recent years, ozone-based bath has been introduced as an alternative cleaning process, which is more environmentally friendly than traditional RCA cleaning. 14,15 The ozone-based method of chemical polishing is carried out in an O 3 + HF solution, avoiding pollution emission of nitrogen. However, the influences of these two CP etching methods on the pyramid profile have not yet been compared in detail.…”
Section: Introductionmentioning
confidence: 99%