Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Abstract

International audienceIt is demonstrated that a graphene-based film (GBF) functionalized with silane molecules strongly enhances thermal performance. The resistance temperature detector results show that the inclusion of silane molecules doubles the heat spreading ability. Furthermore, molecular dynamics simulations show that the thermal conductivity (κ) of the GBF increased by 15%–56% with respect to the number density of molecules compared to that with the nonfunctionalized graphene substrate. This increase in κ is attributed to the enhanced in-plane heat conduction of the GBF, resulting from the simultaneous increase of the thermal resistance between the GBF and the functionalized substrate limiting cross-plane phonon scattering. Enhancement of the thermal performance by inserting silane-functionalized molecules is important for the development of next-generation electronic devices and proposed application of GBFs for thermal management

Thermally Conductive Graphene Films for Heat Dissipation

“…By varying the concentration of GO solution from 8 mg·mL –1 to 18 mg·mL –1 , the thickness of rGO film increases while the thermal and electrical conductivities decrease. The correlation between the thickness and thermal and electrical conductivities is consistent with the results of Liu et al indicating that the increase in the thickness of films leads to the increase in the total number of defects, and the defects apparently impede the phonon and electron propagation in the graphene sheets by creating more obstacles. As a result, the thermal and electrical conductivities decrease as the concentration increases.…”

Enhancing Thermal Conductivity of Graphene Films via Secondary Graphitization under a Direct Current Arc

“…This indicates that arc secondary graphitization treatment is more effective in enhancing the performance of GFs than furnace graphitization. Herein, a thermally conductive GF with a thickness of 100 μm and a thermal conductivity of 1644 ± 11 W/mK was successfully prepared, which showed superior performance compared to those reported in previous studies (Table S3), ,,,,,,− as shown in Figure d. This achievement further confirms the significant role of the DC arc secondary graphitization treatment in enhancing the performance of thermally conductive GFs.…”

Electrochemical depositing rGO-Ti-rGO heterogeneous substrates with higher thermal conductivity and heat transfer performance compared to pure Ti

“…More important, for all the Ti substrates in the thickness of 30, 50 and 100 μm, both the in-plane thermal diffusivity and conductivity of as-prepared substrates present the similar trend: the thermal conductance of substrates with thick rGO is higher than that of the ones with thin rGO, and that of substrates with thin rGO is higher than that of pure Ti substrates. As reported in experimental and simulated research, the thermal conductivity of rGO is high as 1000-2000 W (m K) −1 [10,34,[40][41][42]. In our experiment, there are rGO layers grown on both sides of Ti substrates and to form rGO-Ti-rGO sandwich structure.…”