IGBT condition monitoring with system identification methods

Abstract

This work investigates the a degraded effective heat dissipation path of po devices. Solder layer fatigue is identified as o observed wear-out failures that reduces the and reliability. A health monitoring metho system identification techniques, which all detection of the presence of abnormal ther evaluation of solder layer health. The therm for thermal characterization and it can be u system identification technique. This can e temperature being accurately estimated und degraded heat dissipation path. A fast and burden estimation method is prefer implementation and the Fast Affine Proje used. Compared with conventional adaptive Least Mean Squares and Recursive Least S has fast convergence speed and low computa simulation result shows its superior pe alternative techniques.