2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific (ITEC Asia-Pacific) 2014
DOI: 10.1109/itec-ap.2014.6941216
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Abstract: This work investigates the a degraded effective heat dissipation path of po devices. Solder layer fatigue is identified as o observed wear-out failures that reduces the and reliability. A health monitoring metho system identification techniques, which all detection of the presence of abnormal ther evaluation of solder layer health. The therm for thermal characterization and it can be u system identification technique. This can e temperature being accurately estimated und degraded heat dissipation path. A fast … Show more

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