volume 48, issue 1, P82-94 2006
DOI: 10.1109/temc.2006.870701
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Abstract: Abstract-As multiple chips are being integrated into a single package with increased operating frequency, switching noise coupling on power buses has become an important design issue. To reduce the noise coupling, a split power bus structure has been generally used in package substrates having multilayered power and ground planes. Consequently, there is an increasing need for an efficient method to analyze a split power bus in a multilayered package. This paper introduces a hybrid analytical modeling method f…

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