Conference Record of the Thirty-First IEEE Photovoltaic Specialists Conference, 2005.
DOI: 10.1109/pvsc.2005.1488323
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Hot-melt screen-printing of front contacts on crystalline silicon solar cells

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Cited by 4 publications
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“…However, such fine line metallization processes had to maintain a sufficient lateral conductivity of the grid as well as a sufficiently low contact resistance even on lowly doped emitters to keep series resistance losses at a minimum. Various approaches like screen printing of hotmelt Ag pastes, 48 double printing, 49,50 usage of fine meshes with optimized emulsion, 51 and the application of single and double layer stencils 52 were evaluated and optimized. Intense industrial and academic research and a consequent optimization of machinery, screens, and pastes as well as newly emerging trends in the field of cell interconnection using narrow ribbons or multiple wires enabled an impressive progress towards fine line metallization within the last decade.…”
Section: Introductionmentioning
confidence: 99%
“…However, such fine line metallization processes had to maintain a sufficient lateral conductivity of the grid as well as a sufficiently low contact resistance even on lowly doped emitters to keep series resistance losses at a minimum. Various approaches like screen printing of hotmelt Ag pastes, 48 double printing, 49,50 usage of fine meshes with optimized emulsion, 51 and the application of single and double layer stencils 52 were evaluated and optimized. Intense industrial and academic research and a consequent optimization of machinery, screens, and pastes as well as newly emerging trends in the field of cell interconnection using narrow ribbons or multiple wires enabled an impressive progress towards fine line metallization within the last decade.…”
Section: Introductionmentioning
confidence: 99%
“…However, the agglomeration of the metal paste's particles, in combination with the limited opening areas in the mesh, has restricted the minimum printed finger width to about 60 µm . To overcome this limitation, other kinds of screens, such as two‐layer metal stencils and hybrid stencils , are being developed, and new metallization technologies have been extensively studied, including ink‐jet and hotmelt printing, pad printing , evaporating metal contact , as well as light‐induced plating (LIP) . Ink‐jet masking, followed by high‐precision alignment screen printing and LIP, has been integrated into selective emitter cell production by some equipment suppliers .…”
Section: Introductionmentioning
confidence: 99%
“…It has been developed for decades and efforts have been made to understand the contact mechanisms to improve the cell efficiency in this mature technique since 1970s. Although various advanced screen printing techniques have been evolved to overcome the drawback of the conventional one [22][23][24][25], like the high grid width (more than 100 µm), poor conductivity and aspect ratio which confine the fill factor to not more than 77%. Despite the limitations, because of its simplicity, high productivity and cost effectiveness screen printing is the most commonly implemented metallization technique in industry till date.…”
Section: Front Contact Metallization Methodsmentioning
confidence: 99%
“…An alternative method for screen printing is to use stencil, which has a non-wear advantage and can printing lines with higher definitions down to 30 µm [31]. [25].…”
Section: 11a)mentioning
confidence: 99%