Highly deformable thermal interface materials enabled by covalently-bonded carbon nanotubes

Wang, Hong; Tazebay, Abdullah S.; Yang, Gang; Lin, Henry Taisun; Choi, Woongchul; Yu, Choongho

doi:10.1016/j.carbon.2016.05.017

Cited by 50 publications

(29 citation statements)

References 47 publications

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“…Polymer‐based TIM is widely accepted for its excellent electrical insulation, easy processability, and low cost, yet still largely limited by its low thermal conductivity . To improve its performance, thermally conductive fillers including metal nanoparticles (e.g., Ag, 1–5.5 W m −1 K −1 ), metal oxides (e.g., Al 2 O 3 , MgO, 0.8–2 W m −1 K −1 ), metal nitrides (e.g., BN, 1–3.5 W m −1 K −1 , AlN, 5–10 W m −1 K −1 ), and most recently graphene (1–16 W m −1 K −1 ), and carbon nanotubes (CNTs, 0.5–5 W m −1 K −1 ) are usually included in the polymer matrix. Among all those fillers, boron nitride (BN) is particularly outstanding for its high thermal conductivity, excellent electrical insulation, and low cost .…”

Section: Introductionmentioning

confidence: 99%

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

Han

Gao

et al. 2019

Adv Funct Materials

442

258

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Polymer-based thermal interface materials (TIMs) with excellent thermal conductivity and electrical resistivity are in high demand in the electronics industry. In the past decade, thermally conductive fillers, such as boron nitride nanosheets (BNNS), were usually incorporated into the polymer-based TIMs to improve their thermal conductivity for efficient heat management. However, the thermal performance of those composites means that they are still far from practical applications, mainly because of poor control over the 3D conductive network. In the present work, a high thermally conductive BNNS/ epoxy composite is fabricated by building a nacre-mimetic 3D conductive network within an epoxy resin matrix, realized by a unique bidirectional freezing technique. The as-prepared composite exhibits a high thermal conductivity (6.07 W m −1 K −1 ) at 15 vol% BNNS loading, outstanding electrical resistivity, and thermal stability, making it attractive to electronic packaging applications. In addition, this research provides a promising strategy to achieve high thermal conductive polymer-based TIMs by building efficient 3D conductive networks.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adfm.201900412. graphene [12] (1-16 W m −1 K −1 ), and carbon nanotubes [13] (CNTs, 0.5-5 W m −1 K −1 ) are usually included in the polymer matrix. Among all those fillers, boron nitride (BN) is particularly outstanding for its high thermal conductivity, excellent electrical insulation, and low cost. [14] During the last decade, although many efforts have been made to develop BN-based polymer composite, [15][16][17][18] its real application as TIM is greatly hindered for its moderate thermal conductivity. This could be mainly attributed to the insufficient manipulation of the 3D conductive network. For the same reason, currently reported composites are usually thin films although there is an urgent need for bulk BN-based composite with high thermal conductivity.Here, a BN/epoxy composite with a nacre-mimetic 3D conductive network was constructed by a bidirectional freezing technique. [19][20][21] The boron nitride nanosheets (BNNS) were assembled into an aerogel with long-range aligned lamellar layers, followed by infiltration of epoxy resin. The highly organized 3D conductive network provides prolonged phonon pathways, yielding a much higher thermal conductivity (6.07 W m −1 K −1 ) at a relatively low BN loading (15 vol%) comparing to the similar composites in the literature. Together with its excellent electrical resistivity (2 × 10 12 Ω cm) and thermal stability (glass transition temperature: 120 °C), our composite may find wide applications including TIM for the advanced electronic packaging technology. Keywords3D conductive network, bidirectional freezing, boron nitride, long-range lamellar structure, thermal interface material

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Section: Introductionmentioning

confidence: 99%

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

Han

Gao

et al. 2019

Adv Funct Materials

442

258

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“…The thermal and mechanical performances of the BPCu/PDMS IPCs are compared with other composite TIMs explained in previous work [ 51–56 ] ( Figure ). Even though the volume ratio of the conductive fillers is reduced via better filler alignment introduced by self‐assembly or continuous framework, the composite TIMs in previous works still show limited thermal conductivity improvement (below 10 W m –1 K –1 ) because of the thermal resistance between fillers.…”

Section: Resultsmentioning

confidence: 99%

Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite

Lin

Izard

Valdevit

et al. 2020

Adv Materials Inter

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Thermal interface materials are essential for thermal management in electronics packaging by providing a low resistance thermal pathway between heat sources and heat sinks. Nanostructured materials can be potential candidates for the next‐generation interface materials by coupling their high thermal conductivity and mechanical compliance, suppressing failure even after large numbers of thermal cycles. This work investigates the thermal and mechanical characteristics of a new type of thermal interface materials, consisting of metal/elastomer interpenetrating phase composites. The 3D, highly porous copper scaffolds are fabricated via a fast and simple in situ bubble‐templated electrodeposition process without the presence of solid templates; subsequently, the void fraction of the composite is filled by elastomer infiltration. The presence of elastomer matrix demonstrates limited impact on the thermal conductivity of the composite while it contributes substantially to the mechanical properties, providing the structural flexibility required. Thermal resistance values of 1.2–4.0 cm2 K W–1 are measured upon multiple thermal cycles, confirming the mechanical stability of the composite, without showing any noticeable degradation.

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“…However, the high amount of carbon‐based or bulky structure will give effects on the materials' surface contact and increase thermal resistance. This is due to the weak van der Waals bonding between individual carbon materials and substrate 51 . Therefore, some studies will minimize the density of carbon and introduce other elements to form composite such as polymers composite in a 3D network 52,53 .…”

Section: Thermal Managementmentioning

confidence: 99%

“…Therefore, some studies will minimize the density of carbon and introduce other elements to form composite such as polymers composite in a 3D network 52,53 . The gap between surface is minimized and strengthens bond formation between materials resulting in high thermal conductivity and low Young's modulus 51 . Nevertheless, TIMs are still essential because the electronic system is built from various materials with the rapid growth of electronic design 10 …”

Section: Thermal Managementmentioning

confidence: 99%

A review of thermal interface material fabrication method toward enhancing heat dissipation

et al. 2020

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Summary Thermal interface materials (TIMs) are applied in electronic devices that are involved in heat generation and raising the temperature. The optimization of TIMs is important in heat dissipation to maintain the good performance of devices, low power during operation, and reduced internal damages among small components. The TIMs are inserted between two contact surfaces to enhance thermal conductivity that will reduce the increment of surface temperature in a longer time and facilitates the cooling process with a consistent power supplied to the system with minimum increment. Research on nanomaterials and hybrid materials aims to obtain maximum thermal conductivity and reduce resistance in the devices. However, the suitable fabrication method for achieving good production and performance is still debatable. Therefore, significant fabrication methods have been explored for various materials. This review provides insights into the current work focusing on the materials used in the development of TIMs by various methods. The discussion begins with the introduction of thermal management and the working principles applied in the system. Then, the methods applied for material fabrication into TIMs, including the advantages and disadvantages of the methods, are discussed. Last, the current challenges and opportunities in methods used are discussed to offer new inputs and improvement in method modification for TIMs design. The targeted thermal performance for the industrial market of TIMs for nanomaterial applications is approximately 100 W/mK and 1 × 10−6 m2/WK with lowest power of 100 W.

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Highly deformable thermal interface materials enabled by covalently-bonded carbon nanotubes

Cited by 50 publications

References 47 publications

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite

A review of thermal interface material fabrication method toward enhancing heat dissipation

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