High thermal conductive silicone rubber composites constructed by strawberry-structured Al2O3-PCPA-Ag hybrids

Yang, Dan; Wei, Qungui; Li, Bingyao; Yu, Liyuan; Ni, Yufeng; Zhang, Liqun

doi:10.1016/j.compositesa.2020.106260

Cited by 28 publications

(14 citation statements)

References 48 publications

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“…First, the TA layer enhances the interfacial interaction between BN and the XNBR matrix, decreases the interfacial thermal resistance of XNBR composites, and aids the interfacial phonon transfer . Second, the TA improves dispersion of fillers in the XNBR composites, which is beneficial for forming thermal diffusion channels and providing sufficient pathways for the phonon transport (Figure c). , Furthermore, the fitting λ results of XNBR composites incorporated with various concentration of fillers with the Hashin–Shtrikman model (eq ) are displayed in Figure b, which fit the experimental conductivity coefficient ( K eff ) of XNBR composites: where k 1 is λ of the XNBR composites and ϕ 1 is the volume fraction of BN or BN-TA platelets. As shown in Figure b, R c * of BN-XNBR composites is 0.014, while R c * of BN-TA-XNBR composites is 0.007.…”

Section: Resultsmentioning

confidence: 93%

“…50 Second, the TA improves dispersion of fillers in the XNBR composites, which is beneficial for forming thermal diffusion channels and providing sufficient pathways for the phonon transport (Figure 7c). 28,51 Furthermore, the fitting λ results of XNBR composites incorporated with various concentration of fillers with the Hashin−Shtrikman model (eq 1) are displayed in Figure 7b, which fit the experimental conductivity coefficient (K eff ) of XNBR composites: 52…”

Section: Resultsmentioning

confidence: 98%

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Improved Thermal Conductivity of Polymer Composites by Noncovalent Modification of Boron Nitride via Tannic Acid Chemistry

Gao

Yang

et al. 2021

Ind. Eng. Chem. Res.

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With the advent of the 5G era, hexagonal boron nitride (BN) platelets are ideal fillers to incorporate into polymers for preparing thermally conductive composites, which are applied in relieving the heat dissipation in electronic devices. In this study, we report a green, low cost, and high-efficient method to improve the thermal conductivity (λ) of carboxylated acrylonitrile-butadiene rubber (XNBR) composites via noncovalent modification of boron nitride (BN) via tannic acid (TA) chemistry. The noncovalent TA decorating on the surface of BN without deteriorating the surface structure of BN platelets ensures the high intrinsic λ of BN. Additionally, TA enhances the interfacial compatibility between the filler and matrix, as well as the formation of a thermally conductive path in the composites. The maximum throughplane λ is obtained by 30 vol % BN-TA-XNBR composite as 0.42 W/mK, which is 260% of that for pure XNBR (0.16 W/mK). The excellent dielectric properties of BN-TA-XNBR composites also indicates that the BN-TA-XNBR composites can meet the requirements of high capacitance and low energy loss of electronic devices. In brief, the TA chemistry provides potential applications in large scale production of thermally conductive composites in industries, as well as paves the way for advanced applications in nextgeneration miniaturization and integration of electronic devices.

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Section: Resultsmentioning

confidence: 93%

Section: Resultsmentioning

confidence: 98%

Improved Thermal Conductivity of Polymer Composites by Noncovalent Modification of Boron Nitride via Tannic Acid Chemistry

Gao

Yang

et al. 2021

Ind. Eng. Chem. Res.

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“…With the development of society, electronic power equipment is developing towards high capacity, high integration, and high-power density, which lead to the rapid accumulation of heat generated by electronic power devices. [1][2][3][4] Timely and efficient heat dissipation capacity has become the key factor affecting its service life. Thermal interface material (TIM) is installed between the heat source and the radiator to dissipate the heat generated during the operation of the device in time prolonging the service life of the equipment.…”

Section: Introductionmentioning

confidence: 99%

High conductivity thermoelectric insulation composite silicone rubber prepared by carbon nanotubes and silicon carbide composite filler

Cao

Tong

et al. 2022

Polymer Composites

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Polymer based materials with high conductivity and electric insulation are widely used in new electronic fields as thermal interface material (TIM). In this work, firstly we prepared the mixed fillers of silicon carbide (SiC) and carbon nanotubes (CNT), and then used them to modify silicone rubber (SR) preparing composite SR. The experimental results of TGA showed that the composite silicone rubber had strong thermal stability, and the mass loss was only 5% until about 370°C. Besides, the thermal conductivity was significantly enhanced, which increased from 0.2 (pure SR) to 1.103 W·m−1·k−1 (composite SR containing 3wt%CNT and 20wt%SiC), the enhancement ratio arriving as high as 483.05%. In addition, the composite silicone rubber maintained (water contact angle above 90 °) hydrophobicity and electrical insulation (volume resistivity of composite SR with 3wt%CNT and 20wt%SiC up to 1013 Ω·cm), which effectively prevent leakage risk and reduce voltage loss. Therefore, a small number of mixed fillers of SiC and CNT can effectively improve the combination properties of silicone rubber and provide more ideas for TIM.

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“…TIMs should have the characteristics of high volume resistivity and thermal conductivity (TC) . Polymers are a promising TIMs matrix for thermal management owing to their numerous advantages, including high manufacturing ability, low weight, and low cost . Nevertheless, polymers have a poor intrinsic TC (less than 0.2 W/mK).…”

Section: Introductionmentioning

confidence: 99%

Formation of Thermally Conductive Network Accompanied by Reduction of Interface Resistance for Thermal Conductivity Enhancement of Silicone Rubber

Wei

Yang

2022

ACS Appl. Electron. Mater.

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Utilizing the synergetic effects of different-sized fillers to effectively construct a thermally conductive network in polymer-based composites is an important strategy to dissipate the heat produced by electronic equipment. In this work, a remarkable synergetic efficiency is achieved in silicone rubber (SR) composites loaded with boron nitride-polydopamine-silver (BN-PDA-Ag) and carbon nanotube-polydopamine-silver (CNT-PDA-Ag) systems by constructing a hybrid heat conductive network. Specifically, PDA decreases the interface thermal resistance by improving the compatibility between the fillers and the polymeric matrix, while Ag nanoparticles further enhance thermal conductivity (TC). Finally, the TC value for SR composites reaches 0.655 W/mK, 4.17 times that of SR matrix. Additionally, a high dielectric constant and a relatively low electrical conductivity are obtained for SR composites. Overall, this strategy offers a valuable basis to prepare thermal management materials for application in electronic components.

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High thermal conductive silicone rubber composites constructed by strawberry-structured Al2O3-PCPA-Ag hybrids

Cited by 28 publications

References 48 publications

Improved Thermal Conductivity of Polymer Composites by Noncovalent Modification of Boron Nitride via Tannic Acid Chemistry

Improved Thermal Conductivity of Polymer Composites by Noncovalent Modification of Boron Nitride via Tannic Acid Chemistry

High conductivity thermoelectric insulation composite silicone rubber prepared by carbon nanotubes and silicon carbide composite filler

Formation of Thermally Conductive Network Accompanied by Reduction of Interface Resistance for Thermal Conductivity Enhancement of Silicone Rubber

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