High-strength and high-conductivity in situ Cu–TiB2 nanocomposites

Pan, Shuaihang; Zheng, Tianqi; Yao, Gongcheng; Chi, Yitian; Rosa, Igor M. De; Li, Xiaochun

doi:10.1016/j.msea.2021.141952

Cited by 46 publications

(10 citation statements)

References 43 publications

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“…Finally, the electrical conductivity and tensile strength of TiB y / Cu-X composites prepared by reaction casting after posttreatment that reported in the literatures [12,14,[27][28][29][30][31][32][33][34][35] are compared with our work, as shown in Figure 11. It is found that the deformed (TiB 2p þ TiB w )/Cu composites with Ce can achieve higher tensile strength (>600 MPa).…”

Section: Mechanical Propertiesmentioning

confidence: 78%

Microstructures and Properties of In Situ (TiB_2p+TiB_w)/Cu Composites with Different Ce Content

et al. 2022

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TiB 2p þ TiB w )/Cu composites are prepared by in situ reaction casting. The effect of Ce content on the microstructures, electrical conductivity, and tensile strength of (TiB 2p þ TiB w )/Cu composites are studied. The results show that the right amount of Ce can significantly refine the reinforcements and the copper matrix grains, and improve the morphology and distribution of the reinforcements. Correspondingly, the electrical conductivity and tensile strength of the composites also vary with the Ce contents, but the excess Ce can result in a deterioration of microstructures and properties, and the reasons are also discussed. Finally, a better comprehensive property (78.4 %IACS and 671 MPa) is obtained when the Ce content is 0.04 wt%, which is consistent with the microstructures.

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Section: Mechanical Propertiesmentioning

confidence: 78%

Microstructures and Properties of In Situ (TiB_2p+TiB_w)/Cu Composites with Different Ce Content

et al. 2022

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“…Comparing with the Ti 3 AlC 2 -Gd 2 O 3 /Cu composite without electroless Cu plating on the surface of the Ti 3 AlC 2 , the electrical conductivity of the Cu@Ti 3 AlC 2 -Gd 2 O 3 /Cu composite with Cu plating was slightly increased to 93.6%IACS. The electrical conductivity and elongation of the Cu@Ti 3 AlC 2 -Gd 2 O 3 /Cu composites prepared by the combination of in situ synthesized and ex situ added methods were 93.6%IACS and 17.6% (this paper), which were much higher than that of the TiB 2 /Cu composite in [ 9 ]. However, the tensile strength of the Cu@Ti 3 AlC 2 -Gd 2 O 3 /Cu composite was lower than that of the TiB 2 /Cu composite because 1 wt% Fe was added into the TiB 2 /Cu composite.…”

Section: Resultsmentioning

confidence: 95%

“…The reinforced particles can be introduced by in situ synthesizing or ex situ addition into the Cu matrix composites [ 6 , 7 , 8 , 9 , 10 ]. The compressive strength of an in situ (1.0 wt%) Al 2 O 3 /Cu composite synthesized from powders obtained by electrical explosion of wire was increased nearly 1.6 times compared with pure copper, but its electrical conductivity decreased from 95%IACS to 72%IACS [ 6 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Electroless Cu Plating Ti3AlC2 Particles on Microstructure and Properties of Gd2O3/Cu Composites

Cao

Zhan

2022

Materials

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Ti3AlC2 presents a hexagonal layered crystal structure and bridges the gap between metallic and ceramic properties, and Gadolinia (Gd2O3) has excellent thermodynamic stability, which make them potentially attractive as dispersive phases for Cu matrix composites. In this paper, Cu@Ti3AlC2-Gd2O3/Cu composites, Ti3AlC2-Gd2O3/Cu composites, and Gd2O3/Cu composites were prepared by electroless Cu plating, internal oxidation, and vacuum hot press sintering. The microstructure and the effect of the Cu plating on the properties of the Cu@Ti3AlC2-Gd2O3/Cu composites were discussed. The results showed that a Cu plating with a thickness of about 0.67 μm was successfully plated onto the surface of Ti3AlC2 particles. The ex situ Ti3AlC2 particles were distributed at the Cu grain boundary, while the in situ Gd2O3 particles with a grain size of 20 nm were dispersed in the Cu grains. The electroless Cu plating onto the surface of the Ti3AlC2 particles effectively reduces their surfactivity and improves the surface contacting state between the Cu@Ti3AlC2 particles and the Cu matrix, and reduces electron scattering, so that the tensile strength reached 378.9 MPa, meanwhile, the electrical conductivity and elongation of the Cu matrix composites was maintained at 93.6 IACS% and 17.6%.

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“…On this basis, in-situ synthesis method could perfectly solve the disadvantages that are demonstrated in the composites fabricated by ex-situ preparation methods (addition of existing ceramic phases), such as poor interfacial wettability and weak interfacial bonding between the reinforcing phases and the Cu matrix. As such, the in-situ Cu matrix composites generally demonstrate good thermodynamic stability with refined and homogeneously distributed reinforcements in Cu matrix [88][89][90][91].…”

Section: Special Techniquementioning

confidence: 96%

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms

Yan

Kou

Yang

et al. 2023

Int. J. Extrem. Manuf.

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Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties, thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity. This greatly expands the applications of copper as a functional material in the fields of thermal and conductive components, including electronic packaging materials and heat sinks, brushes, integrated circuit lead frames, etc. So far, endeavors have been focusing on how to choose suitable ceramic components and fully exert the strengthening effect of ceramic particles in the copper matrix. This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles, including ceramic particle content, size, morphology and interfacial bonding, on the diathermancy, electrical conductivity and mechanical behavior of copper matrix composites. The corresponding models and influencing mechanisms are also elaborated in depth. This review contributes to a deeper understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites. By more precise design and manipulation of composite microstructure can help to further improve their comprehensive properties and meet the growing demands in the fields of functional materials.

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High-strength and high-conductivity in situ Cu–TiB2 nanocomposites

Cited by 46 publications

References 43 publications

Microstructures and Properties of In Situ (TiB_2p+TiB_w)/Cu Composites with Different Ce Content

Microstructures and Properties of In Situ (TiB_2p+TiB_w)/Cu Composites with Different Ce Content

Effect of Electroless Cu Plating Ti3AlC2 Particles on Microstructure and Properties of Gd2O3/Cu Composites

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms

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High-strength and high-conductivity in situ Cu–TiB2 nanocomposites

Cited by 46 publications

References 43 publications

Microstructures and Properties of In Situ (TiB2p+TiBw)/Cu Composites with Different Ce Content

Microstructures and Properties of In Situ (TiB2p+TiBw)/Cu Composites with Different Ce Content

Effect of Electroless Cu Plating Ti3AlC2 Particles on Microstructure and Properties of Gd2O3/Cu Composites

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms

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Microstructures and Properties of In Situ (TiB_2p+TiB_w)/Cu Composites with Different Ce Content

Microstructures and Properties of In Situ (TiB_2p+TiB_w)/Cu Composites with Different Ce Content