High speed hybrid silicon evanescent electroabsorption modulator

Kuo, Ying-Hao; Chen, Hui-Wen; Bowers, John E.

doi:10.1364/oe.16.009936

Cited by 87 publications

(63 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Hydrophilic bonding, adhesion, and hybrid integration techniques for photonic microelectronic fabrication have generated a useful set of active and passive optical components for integration into microelectronic devices [2]. Some of the many photonic structures created include Fabry-Perot cavities [16,19], racetrack rings [20], mode-lock lasers [21], microdisks [22], distributed feedback lasers [23], distributed Bragg reflectors [24], micro-rings [25] lasers, amplifiers [26], PIN [27], metal-semiconductor-metal junctions [28] photodetectors, electroabsorption modulators [29], Mach-Zehnder interferometers [30], micro-disk modulators [31], and high-speed switches [32]. More advanced integration circuits have also been demonstrated [28,33].…”

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

Electrospinning for nano- to mesoscale photonic structures

et al. 2016

View full text Add to dashboard Cite

Abstract:The fabrication of photonic and electronic structures and devices has directed the manufacturing industry for the last 50 years. Currently, the majority of small-scale photonic devices are created by traditional microfabrication techniques that create features by processes such as lithography and electron or ion beam direct writing. Microfabrication techniques are often expensive and slow. In contrast, the use of electrospinning (ES) in the fabrication of microand nano-scale devices for the manipulation of photons and electrons provides a relatively simple and economic viable alternative. ES involves the delivery of a polymer solution to a capillary held at a high voltage relative to the fiber deposition surface. Electrostatic force developed between the collection plate and the polymer promotes fiber deposition onto the collection plate. Issues with ES fabrication exist primarily due to an instability region that exists between the capillary and collection plate and is characterized by chaotic motion of the depositing polymer fiber. Material limitations to ES also exist; not all polymers of interest are amenable to the ES process due to process dependencies on molecular weight and chain entanglement or incompatibility with other polymers and overall process compatibility. Passive and active electronic and photonic fibers fabricated through the ES have great potential for use in light generation and collection in optical and electronic structures/ devices. ES produces fiber devices that can be combined with inorganic, metallic, biological, or organic materials for novel device design. Synergistic material selection and postprocessing techniques are also utilized for broad-ranging applications of organic nanofibers that span from biological to electronic, photovoltaic, or photonic. As the ability to electrospin optically and/or electronically active materials in a controlled manner continues to improve, the complexity and diversity of devices fabricated from this process can be expected to grow rapidly and provide an alternative to traditional resource-intensive fabrication techniques.

show abstract

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

Electrospinning for nano- to mesoscale photonic structures

et al. 2016

View full text Add to dashboard Cite

show abstract

“…The pyramids at the top of p-InP layer are results of HCl wet etching during InP substrate removal due to the damaged outer InGaAs layer. With this epilayer transferring technology, the two disparate materials Si and III-V's now can be brought together to realize a variety of active devices on Si, such as lasers (Fang et al, 2006;Fang et al, 2008;Sun et al, 2009), amplifiers (Park et al, 2007a), modulators Kuo et al, 2008), and detectors (Park et al, 2007b). To take the hybrid Si lasers for an example: as seen in Fig.…”

Section: Bonding Proceduresmentioning

confidence: 99%

Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications

Shearn¹,

Sun²,

Henry³

et al. 2010

Semiconductor Technologies

View full text Add to dashboard Cite

“…Several key components have been successfully demonstrated on the hybrid silicon evanescent platform, such as lasers [4], optical ampliers [5], tunable lters [6] and photodetectors [7]. Furthermore, electroabsorption modulators and grating couplers for silicon platform are the key elements for the optical interconnects, especially for the inter-chip interconnects using the SOI wafer [8].…”

Section: Introductionmentioning

confidence: 99%

High Performance Hybrid Silicon Evanescent Traveling Wave Electroabsorption Modulators

Abedi

Afrouz

2013

Acta Phys. Pol. A

View full text Add to dashboard Cite

In this paper, for the rst time, a high performance hybrid silicon evanescent traveling wave electroabsorption modulator based on asymmetric intra-step-barrier coupled double strained quantum wells active layer is introduced which has double steps at III/V mesa structure. Through this active layer, hybrid silicon evanescent traveling wave electroabsorption modulator will be advantages such as very low insertion loss, zero chirp, high extinction ratio, and large Stark shift and better gures of merit as compared with multiquantum well and intra-step quantum well structures. Furthermore, traveling wave electroabsorption modulator with double steps III/V mesa structure results in a wider bandwidth as compared with one-step III/V mesa and mushroom structures. For the modulator with double steps III/V mesa structure with a 200 µm length, the 3 dB bandwidths are obtained as 132 and 52 GHz for 25 and 40 Ω characteristic impedances, respectively.

show abstract

High speed hybrid silicon evanescent electroabsorption modulator

Cited by 87 publications

References 13 publications

Electrospinning for nano- to mesoscale photonic structures

Electrospinning for nano- to mesoscale photonic structures

Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications

High Performance Hybrid Silicon Evanescent Traveling Wave Electroabsorption Modulators

Contact Info

Product

Resources

About