APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058)
DOI: 10.1109/apec.2000.826116
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High power density DC/DC converter using thick-film hybrid technology

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Cited by 11 publications
(3 citation statements)
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“…The voltage derating factor is 60% (Class-II). Thick-film hybrid integrated circuit (TF-HIC) process [26]- [28] installs passive components and bare integrated chips (die) on the substrate with screen-printed conductors and resistors, then connecting components and conductors with wire bonding. TF-HIC process is flexible and has good heat dissipation performance; bare chips avoid the reliability problems caused by the package.…”
Section: A Derating Designmentioning
confidence: 99%
“…The voltage derating factor is 60% (Class-II). Thick-film hybrid integrated circuit (TF-HIC) process [26]- [28] installs passive components and bare integrated chips (die) on the substrate with screen-printed conductors and resistors, then connecting components and conductors with wire bonding. TF-HIC process is flexible and has good heat dissipation performance; bare chips avoid the reliability problems caused by the package.…”
Section: A Derating Designmentioning
confidence: 99%
“…The advantage of using switching technology, which has Less Power Dissipation, reduced stored energy and reduction in system size. Since this technology utilize advanced thick film hybrid technology that allows for less variation in component design, reduction in mechanical packaging and less weight [3,4] III.…”
Section: IImentioning
confidence: 99%
“…Resonant topologies [25][26][27][28][29][30][31] exhibit other advantages for this application. They present two main properties: the capability of transferring power to the microvalve and the possibility of combining the power signal and the control one, the latter determining which valve should be activated.…”
Section: Power Topologymentioning
confidence: 99%