High-performance DUV inspection system for 100-nm generation masks

Abstract

Mask inspection has become a much more important factor in LSI manufacturing. In order to perform mask inspection with high reliability for devices of 100-130 nm rule and below, a highresolution and high-speed die-to-database inspection system is indispensable. In order to satisfy these requirements, the Toshiba MC-3500, a next-generation mask inspection system using 257nm DUV short wavelength optics, has been developed. The MC-3500 employs a die-to-database comparison method and a high-performance data processing system that is newly developed. This paper reports the system configuration, basic characteristics for defect detection and inspection performance.