KEM 2009 DOI: 10.4028/ View full text
Kazuya Yamamura, Tetsuya Morikawa, Masaki Ueda

Abstract: Thickness uniformity of an AT-cut quartz crystal wafer is essential requirement for higher productivity of quartz resonator in the sense of reducing the frequency adjusting process after dicing the wafer. However, commercially available quartz crystal wafers typically have a thickness distribution of ±0.1%, which is induced in conventional mechanical fabrication processes, such as cutting with a wire saw, lapping and polishing. Furthermore, owing to the poor parallelism and the existence of subsurface damage, …

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