2020 IEEE International Electron Devices Meeting (IEDM) 2020
DOI: 10.1109/iedm13553.2020.9372068
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High-density SOT-MRAM technology and design specifications for the embedded domain at 5nm node

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Cited by 26 publications
(17 citation statements)
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“…The resistance of the MTJ depends on the relative magnetization directions between the free layer and the reference layer. Speciically, if the relative magnetization of the free layer and reference layer are parallel (P), indicating the low resistance (RP); otherwise, if the relative magnetizations are anti-parallel (AP), indicating the high resistance (RAP) [21]. Therefore, one MTJ can store one bit of data depending on the resistance state.…”
Section: Fundamentals Of Stt-mrammentioning
confidence: 99%
“…The resistance of the MTJ depends on the relative magnetization directions between the free layer and the reference layer. Speciically, if the relative magnetization of the free layer and reference layer are parallel (P), indicating the low resistance (RP); otherwise, if the relative magnetizations are anti-parallel (AP), indicating the high resistance (RAP) [21]. Therefore, one MTJ can store one bit of data depending on the resistance state.…”
Section: Fundamentals Of Stt-mrammentioning
confidence: 99%
“…This is done using compact models that capture the key switching mechanisms and physical properties of the devices, which are deduced from either physics-based or behavioral models [183,230]. Importantly the critical current at 1 ns reduces to 100 µA for a 32 nm track according to SOT compact models [231].…”
Section: Sot Cell Dimension Optimizationmentioning
confidence: 99%
“…Consequently, one will have to consider design strategies with optimal high-performance (HP) but increased FEOL, or with degraded performances but optimal density: highdensity (HD). Keeping in mind these limitations, three alternative bit-cell solutions with four terminals were proposed [231]: shared WL (SOT-SWL) of types 1 and 2, shown in Fig. 13(b) and (c), and shared BL (SOT-SBL) shown in Fig.…”
Section: Bit-cell Configurations and Design Technology Co-optimizationmentioning
confidence: 99%
“…A convolutional stride of 6 with no pooling leads to a BR of 13.5×, also with a maximum of 64 weight transistors per pixel 2 . Note, using chip stacking in which weight transistors are integrated vertically on a stacked chip through metal-to-metal fusion bonding [10] or through-silicon-vias (TSVs) [21], minimal to no increase in pixel area is expected because of the dense metal-pitch (MP) and contacted poly-pitch (CPP) [11] of advanced technology nodes and the relatively large sizes of underlying pixel arrays.…”
Section: B Bandwidth Vs Number Of Transistorsmentioning
confidence: 99%