2021
DOI: 10.1007/s40820-021-00767-4
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Abstract: The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution. Herein, the hierarchical design and assembly strategy was adopted to fabricate hierarchically multifunctional polyimide composite films, with graphene oxide/expanded graphite (GO/EG) as the top thermally conductive and EMI shielding layer, Fe3O4/polyimide (Fe3O4/PI) as the mid… Show more

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Cited by 152 publications
(60 citation statements)
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“…Recently, many studies have been conducted to develop highly functional polyimide (PI) materials with superior thermo-mechanical properties, excellent processability, and high optical transparency compared with conventional PI [1][2][3]. Among the newly developed PIs, colorless and transparent PIs (CPIs) have attracted significant attention in the field of electronic materials for diverse applications, such as flexible display substrates, semiconductors, and electro-optical devices [4][5][6].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, many studies have been conducted to develop highly functional polyimide (PI) materials with superior thermo-mechanical properties, excellent processability, and high optical transparency compared with conventional PI [1][2][3]. Among the newly developed PIs, colorless and transparent PIs (CPIs) have attracted significant attention in the field of electronic materials for diverse applications, such as flexible display substrates, semiconductors, and electro-optical devices [4][5][6].…”
Section: Introductionmentioning
confidence: 99%
“…The BN/SG strips composed of vertically aligned BN in the center and thin horizontally aligned layers on the top and bottom surfaces, featuring the continuous and scalable production, are promising for thermal management of electronic devices [28,[52][53][54]. Figure 6a shows the through-plane thermal conductivity (TC) of both V-BN and R-BN composites gradually increases with increasing BN contents while values for expansion-flow-assisted extrusion with the 0.2-2 mold are always larger than that for random mixing.…”
Section: Thermo-conductive Characterization Of the Bn/sg Stripsmentioning
confidence: 99%
“…Graphene exhibits a high strength, thermal conductivity, and conductivity, and graphene-based fillers are widely used for reinforcing polymers to prepare functional composites for use in several application, including heat, electricity, and bionics [ 19 21 ]. However, compared with that of pristine polymers, thermal conductive composites exhibit more complex self-healing mechanisms owing to the chemical and structural differences between polymer and graphene fillers.…”
Section: Introductionmentioning
confidence: 99%