Hierarchically hydrogen-bonded graphene/polymer interfaces with drastically enhanced interfacial thermal conductance

Zhang, Lin; Liu, Ling

doi:10.1039/c8nr08760a

Cited by 46 publications

(31 citation statements)

References 65 publications

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“…It is well established that TBC depends on the bonding strength at the interface, which has been predicted by analytical models [36], molecular dynamics simulations [37][38][39][40][41] and experiments [42][43][44][45]. In this study, the observed increase in G is most likely caused by an increase in adhesion between the metal and polymer.…”

Section: Resultssupporting

confidence: 54%

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

et al. 2020

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In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic–inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal–polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1–15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal—either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal–polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 106 W·m−2·K−1 to 115 × 106 W·m−2·K−1, while the nickel layer increased TBC to 139 × 106 W·m−2·K−1. These results shed light on possible strategies to improve heat transport in organic electronic systems.

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Section: Resultssupporting

confidence: 54%

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

et al. 2020

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“…These studies have investigated the effects of various characteristics of SAMs on the interfacial thermal conductance from two different points of view: (1) considering accurate information about SAM, including SAM coverage [4,9,10], length of SAMs [4,[11][12][13], distinct functional group [9,[13][14][15][16][17], heterogeneous fin structure [18], vibrational spectral overlapping [9], nanoscale roughness [19][20][21], and so on. Huang et al [16] investigated interfacial thermal conductance (ITC) across the interface of water and gold tailored with -CH 3 SAM, -OHSAM, and -COOHSAM.…”

Section: Introductionmentioning

confidence: 99%

Molecular Structure Effect of a Self-Assembled Monolayer on Thermal Resistance across an Interface

et al. 2021

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Understanding heat transfer across an interface is essential to a variety of applications, including thermal energy storage systems. Recent studies have shown that introducing a self-assembled monolayer (SAM) can decrease thermal resistance between solid and fluid. However, the effects of the molecular structure of SAM on interfacial thermal resistance (ITR) are still unclear. Using the gold–SAM/PEG system as a model, we performed nonequilibrium molecular dynamics simulations to calculate the ITR between the PEG and gold. We found that increasing the SAM angle value from 100° to 150° could decrease ITR from 140.85 × 10−9 to 113.79 × 10−9 m2 K/W owing to penetration of PEG into SAM chains, which promoted thermal transport across the interface. Moreover, a strong dependence of ITR on bond strength was also observed. When the SAM bond strength increased from 2 to 640 kcal⋅mol−1Å−2, ITR first decreased from 106.88 × 10−9 to 102.69 × 10−9 m2 K/W and then increased to 123.02 × 10−9 m2 K/W until reaching a steady state. The minimum ITR was obtained when the bond strength of SAM was close to that of PEG melt. The matching vibrational spectra facilitated the thermal transport between SAM chains and PEG. This work provides helpful information regarding the optimized design of SAM to enhance interfacial thermal transport.

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“…The first candidate that came to mind was poly(vinyl alcohol) (PVA, [-CH 2 -CHOH-] n ), because its melting point is above 200 1C 17,18 and it introduces only a minor change in the carbon chain of PE ([-CH 2 -CH 2 -] n ) by replacing a hydrogen (-H) with a hydroxyl (-OH) 19 in each segment. The literature 20,21 shows that this replacement should result in the evolution of a phonon dispersion curve (Fig.…”

Section: Introductionmentioning

confidence: 99%

High thermal conductivity polymer chains with reactive groups: a step towards true application

Chen

Zhou

et al. 2020

Mater. Adv.

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Hierarchically hydrogen-bonded graphene/polymer interfaces with drastically enhanced interfacial thermal conductance

Abstract: Hierarchically hydrogen-bonded interface was designed to drastically enhance the interfacial thermal conductance between materials of drastically different vibrational properties.

Cited by 46 publications

References 65 publications

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

Molecular Structure Effect of a Self-Assembled Monolayer on Thermal Resistance across an Interface

High thermal conductivity polymer chains with reactive groups: a step towards true application

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