Grain boundary networks in Y123 coated conductors: Formation, properties and simulation

Holzäpfel, B.; Fernández, Lidia Rodríguez; Schindler, Felix; Boer, B. de; Reger, N.; Eickemeyer, J.; Berberich, P.; Prusseit, W.

doi:10.1109/77.919911

Cited by 35 publications

(29 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…There will be dissipation at the interface determined as the location of the minimum-cut which corresponds to it becoming a flux-flow channel [97,120]. [114] have demonstrated the general validity of the modelling approach. One use of such models has been to predict the scaling behaviour of coated conductors.…”

Section: Calculating the Critical Currentmentioning

confidence: 92%

“…The problem of calculating the largest current which can cross the conductor (the "maximum flow") can be reduced to one of finding the interface which limits such flow (the "minimum cut") [119]. There are a number of algorithms to achieve this [114,111,97], and it is possible to make approximations which trade off a rigorously exact solution in order to be able to efficiently solve a network containing millions of nodes and arcs. The maximumflow/minimum-cut theorem sheds some light upon what happens physically when the critical current of the conductor is exceeded.…”

Section: Calculating the Critical Currentmentioning

confidence: 99%

“…Holzapfel and co-workers [30,113] have therefore applied network models to real grain structures which have been measured by EBSD. One significant advantage of this is the ability to prove the functionality of such a modelling method in describing an area of conductor whose properties can actually be measured [114]. The method is obviously limited to the size of sample which can be measured using EBSD.…”

Section: Microstructural Modelsmentioning

confidence: 99%

See 2 more Smart Citations

Importance of low-angle grain boundaries in YBa₂Cu₃O_7−δcoated conductors

Durrell¹,

Rutter²

2008

Supercond. Sci. Technol.

View full text Add to dashboard Cite

Abstract. Over the past ten years the perception of grain boundaries in YBa 2 Cu 3 O 7−δ conductors has changed greatly. They are no longer a problem to be eliminated but an inevitable and potentially favourable part of the material. This change has arisen as a consequence of new manufacturing techniques which result in excellent grain alignment, reducing the spread of grain boundary misorientation angles. At the same time there is considerable recent evidence which indicates that the variation of properties of grain boundaries with mismatch angle is more complex than a simple exponential decrease in critical current. This is due to the fact that low-angle grain boundaries represent a qualitatively different system to high angle boundaries. The time is therefore right for a targetted review of research into low-angle YBa 2 Cu 3 O 7−δ grain boundaries. This article does not purport to be a comprehensive review of the physics of grain boundaries as found in YBa 2 Cu 3 O 7−δ in general; for a broader overview we would recommend that the reader consult the comprehensive review of Hilgenkamp and Mannhart (Rev. Mod. Phys., 74, 485, 2002). The purpose of this article is to review the origin and properties of the low-angle grain boundaries found in YBa 2 Cu 3 O 7−δ coated conductors both individually and as a collective system.

show abstract

Section: Calculating the Critical Currentmentioning

confidence: 92%

Section: Calculating the Critical Currentmentioning

confidence: 99%

Section: Microstructural Modelsmentioning

confidence: 99%

See 1 more Smart Citation

Importance of low-angle grain boundaries in YBa₂Cu₃O_7−δcoated conductors

Durrell¹,

Rutter²

2008

Supercond. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…In this model, the experimentally obtained EBSD maps of the CeO 2 and the LZO buffer layer are transposed to a virtual YBCO-grain boundary network to find the limiting path of the current and to calculate the J C in comparison to the maximum value. The exact procedure is described in detail in [7]. The simulations gave J C -values of ca 34 % (LZO) and 52 % (CeO 2 ) of the maximum current density.…”

Section: "Limiting Path Calculation"mentioning

confidence: 99%

Chemical solution deposition (CSD) of CeO₂and La₂Zr₂O₇buffer layers on cube textured NiW substrates

Kotzyba

Obst

Nast

et al. 2006

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

“…The calculation of current percolation through disordered networks of weak links, some of which may be Josephson junctions, is a complex problem [6]; and several algorithms have been developed for its solution (see, e. g. Ref. 6,(15)(16)(17)(18)(19). As the fast algorithms are limited to two-dimensional networks, for the present work a new one had to be devised.…”

mentioning

confidence: 99%

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Hammerl

Herrnberger

Schmehl

et al. 2002

Applied Physics Letters

View full text Add to dashboard Cite

It is shown that the critical current density of high-Tc wires can be greatly enhanced by using a threefold approach, which consists of grain alignment, doping, and optimization of the grain architecture. According to model calculations, current densities of 4 · 10 6 A/cm 2 can be achieved for an average grain alignment of 10• at 77 K. Based on this approach, a road to competitive high-Tc cables is proposed.Vital for large scale applications of high-T c superconductors [1,2] is the solution of the grain boundary problem, which manifests itself by the exponential decrease of the grain boundary critical current density J c of the high-T c cuprates as a function of the grain boundary angle [3,4].We propose to solve this problem using a threefold approach: through 1) grain alignment [3], 2) grain boundary doping [5], and 3) optimization of the microstructure to maximize the effective grain boundary area [6]. In contrast to the powder-in-tube technology where large grain boundary areas and grain alignment are used to enhance J c [7-9], today's coated conductor technologies [10][11][12] focus on grain alignment only. As we have shown, however, simple ways exist to also preferentially dope the grain boundaries [5] and engineer large effective grain boundary areas [13,14] to further enhance the performance of coated conductors.As pointed out in 1987, large effective grain boundary areas can be realized by engineering the microstructure of the superconductor to obtain grains with big aspect ratios, for example by stacking in a brickwall-type manner platelet-like grains on top of each other [6,7]. The enhancement of the critical currents hereby gained is responsible for the large J c of the Bi-based high-T c superconductors fabricated with the powder-in-tube technology [6-9]. Recently we found ways to use large effective grain boundary areas to enhance J c of coated conductors that consist of two-or three dimensional grain boundary networks, as illustrated in Fig. 1. Although it is clear that each one of the three techniques described substantially enhances J c , the increase that can be gained by utilizing all three, for example as shown by Fig. 2, is unknown.Therefore we have calculated the performance, which can be achieved by combining grain orientation, doping, and large effective grain boundary areas. Based on these calculations, optimized sets of parameters for the fabrication of coated conductors are derived. The calculation of current percolation through disordered networks of weak links, some of which may be Josephson junctions, is a complex problem [6]; and several algorithms have been developed for its solution (see, e. g. Ref. 6,(15)(16)(17)(18)(19). As the fast algorithms are limited to two-dimensional networks, for the present work a new one had to be devised. Like in several of the existing algorithms, to achieve the required speed, phase effects and self fields were neglected. FIG. 2.Simplified sketch of a tape, fabricated by the rolling assisted biaxially textured substrate (RABiTS) technology, with a m...

show abstract

Grain boundary networks in Y123 coated conductors: Formation, properties and simulation

Cited by 35 publications

References 8 publications

Importance of low-angle grain boundaries in YBa₂Cu₃O_7−δcoated conductors

Importance of low-angle grain boundaries in YBa₂Cu₃O_7−δcoated conductors

Chemical solution deposition (CSD) of CeO₂and La₂Zr₂O₇buffer layers on cube textured NiW substrates

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Contact Info

Product

Resources

About

Grain boundary networks in Y123 coated conductors: Formation, properties and simulation

Cited by 35 publications

References 8 publications

Importance of low-angle grain boundaries in YBa2Cu3O7−δcoated conductors

Importance of low-angle grain boundaries in YBa2Cu3O7−δcoated conductors

Chemical solution deposition (CSD) of CeO2and La2Zr2O7buffer layers on cube textured NiW substrates

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Contact Info

Product

Resources

About

Importance of low-angle grain boundaries in YBa₂Cu₃O_7−δcoated conductors

Importance of low-angle grain boundaries in YBa₂Cu₃O_7−δcoated conductors

Chemical solution deposition (CSD) of CeO₂and La₂Zr₂O₇buffer layers on cube textured NiW substrates