2010 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE 2010) 2010
DOI: 10.1109/date.2010.5456979
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General behavioral thermal modeling and characterization for multi-core microprocessor design

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Cited by 12 publications
(11 citation statements)
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“…Eguia et al [22], [23] improve the previous approach by using a subspace state-space system identification algorithm. As main advantage, it allows to use a generic input vector instead of an impulse stimulus and to identify directly a MIMO system.…”
Section: Related Workmentioning
confidence: 98%
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“…Eguia et al [22], [23] improve the previous approach by using a subspace state-space system identification algorithm. As main advantage, it allows to use a generic input vector instead of an impulse stimulus and to identify directly a MIMO system.…”
Section: Related Workmentioning
confidence: 98%
“…technological and design parameters), it enables an effective physical interpretation of the model states with a reduced model order and can capture some real-life behaviours, which are very hard to be caught by simulations: the model learnt is a direct image of the specific device in the deployed environment. Compared to compact model learning strategies [17]- [20], [22], [23], it reduces the parameter set, avoiding over-parametrization and reducing the occurrences of multiple optimums in parameters identification. This is achieved by embedding in the model parameters optimization routine a set of physically meaningful constraints directly derived from thermal laws as the heat equation and the Fourier law.…”
Section: Contributionsmentioning
confidence: 98%
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“…Such an option is well suited to deal with process variability and heat sink imperfections. Similarly, since having different fan speeds changes the thermal conductivity of the heat sink, a method like the one in [10] can also help to adapt the thermal model at runtime, or to consider multiple thermal models from which to choose (one for each fan speed).…”
Section: Thermal Modelmentioning
confidence: 99%
“…A more practical alternative is to use some thermal modeling method that relies on real measurements on a specific chip and cooling solution, e.g., [10]. Such an option is well suited to deal with process variability and heat sink imperfections.…”
Section: Thermal Modelmentioning
confidence: 99%