We report on a GaN metal-oxide-semiconductor field-effect-transistor (MOSFET) using atomic-layer-deposited (ALD) Al 2 O 3 as the gate dielectric. Compared to a GaN metal-semiconductor field-effect-transistor (MESFET) of similar design, the MOSFET exhibits several orders of magnitude lower gate leakage and near three times higher channel current. This implies that the ALD Al 2 O 3 /GaN interface is of high quality and the ALD Al 2 O 3 /GaN MOSFET is of interest and potential for high-power RF and digital appli…
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