Functional Multilayer Ceramic Substrate for Rfmodules

Shirasaki, Takayuki; Tagami, Kenji; Kubo, Takanori; Makihara, Chihiro

doi:10.1109/euma.1999.338379

Cited by 1 publication

(1 citation statement)

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“…This work was the first step of integrating electronics on back panel for the most compact LTCC-M PDP. There is still much room for integration of electronic components since the LTCC-M technology can make it possible to fabricate high density package and Multi Chip Module (MCM) for PDP and embed the passive elements into LTCC multilayer circuits [5]. All of these distinctive advantages of LTCC-M PDP make it possible to realize the dream of hangon-the PDPs.…”

Section: Resultsmentioning

confidence: 99%

32.4: Driver IC Integrated LTCC‐M PDP Back Panel

Baik¹,

Ryu²,

Cho³

et al. 2001

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Currently Plasma Display Panel (PDP) is the best promising candidate for large area digital display, especially hang-on-thewall digital TVs. Many processes have been developed to manufacture the competitive PDP. We have researched the unique process for fabricating plasma display back panel by the Low Temperature Co-fired Ceramics on Metal (LTCC-M) technology, which is very simple and cost effective manufacturing process [1]. In the year 2000 we presented the evaluation results of 40" LTCC-M plasma display back panel and succeeded in fabricating LTCC-M PDP module [2]. In this paper, we present a new LTCC-M PDP back panel on which the driver ICs are integrated by using LTCC package technology. This new PDP back panel gives us many advantages by directly integrating the driver ICs, which leads to elimination of connection parts and driver IC's circuit boards, enhancing signal speed, reducing the PDP module size and lowering the material cost.

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Section: Resultsmentioning

confidence: 99%