Fully screen printed LRC resonant circuit

Ashebir, Getinet; Zambou, Serges; Männl, Ulrich; Rhyme, Setshedi; Härting, M.; Britton, D.T.

doi:10.1016/j.mee.2016.04.021

Cited by 12 publications

(5 citation statements)

References 28 publications

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“…These components include antennas, resistors, coils, capacitors, resonators, and their many variations coupled to physical quantities: pressure, electric and magnetic fields, and mechanical torques and forces. Recently there were several attempts to fabricate these devices into a 3D shape via bond‐wire, liquid metals, printing, special mechanical assembly, and chemical processes to form coils, capacitors, and resonators ( Figure ). However, these techniques suffered from low resolution and complexity, and their sequential nature of fabrication was not conducive to the parallel, mass production of semiconductor devices.…”

Section: Scaling Challenges In Modern Electronic Systemsmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

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Section: Scaling Challenges In Modern Electronic Systemsmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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“…Such inks kept their electrical ability even after printing and curing [38]. Printed electronics are now widely used as a method of deposition and production of electronic devices [39], especially for applications where the speed of the device is not the first criterion of operation. Screen printing, as one of the cheapest and fast processing techniques used in printed electronics, consists of an additive deposition of electronic inks to form a given pattern or produce components, devices, and circuits.…”

Section: Introductionmentioning

confidence: 99%

Screen printed logic gates employing milled p-silicon as an active material

Zambou¹,

Britton²,

Härting³

2016

Flex. Print. Electron.

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This work reports on the fabrication and characterization of all screen printed logic gates. The logic gates presented in this work were printed on plain paper (80 gsm) and employed milled p-silicon as the active layer. The active material used presented a varistor-like electrical behavior in an extended range of temperatures from 340-10 K. Current driven switches were produced and used as the building blocks for the logic gates. The fundamental OR and AND boolean logic gates were demonstrated at room temperature. Their various input and output voltage levels are presented. It was also shown that the active materials and switches presented a better electrical performance at cryogenics temperature. Thus, these logic gates have the potential to be applied for use in a cryogenics environment. The advantages and limitations of the printed logic gates are discussed by comparing them to conventional logic gates.

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“…The self-resonance frequency of printed inductors exceeds 10 GHz. Ashebir et al [325] screen-printed the RLC circuit. Capacitors were printed using silver ink for electrodes and barium titanate ink as a dielectric material.…”

Section: Rlc Passivesmentioning

confidence: 99%

Printed Electronics in Radiofrequency Energy Harvesters and Wireless Power Transfer Rectennas for IoT Applications

Skarżyński

Słoma

2023

Adv Elect Materials

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The Internet of Things is currently one of the fastest-growing branches in electronics. The development of energy storage systems and the miniaturization of dedicated printed circuit boards significantly influence that growth. However, the need for batteries and traditional printed circuit boards still limits devices' minimum size, weight, and cost, narrowing the application area. Energy harvesters and wireless power transfer systems fabricated with printed electronics can significantly reduce such devices' weight, size, and cost. Printed electronics technology provides scalable tools for many electronics applications, shortening the validation time and enabling new low-cost or disposable solutions on lightweight and flexible substrates embedded inside 3D printed structures and directly on device housings. Energy harvesting and wireless power transfer systems in electronic devices can provide enough power to minimize battery capacity and size or even eliminate the need for batteries in low-power applications. This review presents an adaptation of printed electronics technology in the fabrication of radio frequency energy harvesters and wireless power transfer rectennas for IoT applications. Last, perspectives for development towards greater integration with microsystems, transient electronics with ecofriendly materials, adaptation for next-generation telecommunication systems, and 3D structural electronics solutions are briefly discussed.

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Fully screen printed LRC resonant circuit

Cited by 12 publications

References 28 publications

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Screen printed logic gates employing milled p-silicon as an active material

Printed Electronics in Radiofrequency Energy Harvesters and Wireless Power Transfer Rectennas for IoT Applications

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