A new method of fabricating porous silicon emitting in the ultraviolet ͑UV͒ spectral region is presented. This method uses photoetching in an aqueous salt ͑KF͒ solution. Strong UV photoluminescence is observed at ϳ3.3 eV with a full width at a half maximum of ϳ0.1 eV, which is much narrower than those reported previously. Fourier transform infrared spectroscopy suggests that the surface oxide produced during photoetching plays an important role in the UV emission of the KF-prepared PSi. © 2005 American Institute of Physics. ͓DOI: 10.1063/1.2149157͔The observation of visible room-temperature photoluminescence ͑PL͒ from porous silicon ͑PSi͒ for understanding the optical properties of silicon and fabricating silicon-based optoelectronic devices has attracted considerable interest. 1 Most of the PSi films were produced by anodic etching in a HF-based solution. Since this method requires electrodes both in the electrolyte solution and on the back surface of the silicon wafer, it makes the formation of PSi layers in various complex material systems and structures difficult.To overcome this, Fathauer et al. 2 carried out stain etching of silicon in HF : HNO 3 :H 2 O 2 solutions and obtained porous layers similar to those produced by anodic etching. Several groups also proposed a method of photoetching in an aqueous HF solution or a mixture of HF and H 2 O 2 under the illumination of a He-Ne laser. 3,4 Such photosynthesized PSi samples showed a red or a yellow emission at room temperature. [2][3][4] In this letter, we report on the properties of ultraviolet ͑UV͒-emitting PSi studied by PL, ex situ atomic force microscopy ͑AFM͒, and Fourier transform infrared ͑FTIR͒ spectroscopy. The PSi samples investigated here are formed by photoetching in an aqueous salt ͑KF͒ solution. Recently, we have shown that an aqueous KF solution causes the removal of the native oxide on silicon upon immersing the sample into the solution. 5 Note that KF is less toxic and easier to handle than HF. Our prepared PSi emits a strong and stable UV light with a considerably narrow spectral width.The samples used in this study were n-type Si͑111͒ with a resistivity of 13-20 ⍀ cm. They were first degreased using organic solvents in an ultrasonic bath and then rinsed in deionized ͑DI͒ water. Photochemical etching was performed by illuminating a 5 mW He-Ne laser ͑ = 632.8 nm͒ onto the sample surface in 1 M KF solution. The laser spot size was approximately 1 mm. For comparison, we fabricated PSi using the same method, but immersed in 25% ͑12.5 M͒ HF solution. After photoetching, the samples were rinsed in DI water.The surface morphology of the PSi samples was investigated by ex situ AFM, using a Digital Instruments Nanoscope III. PL measurements were performed using a grating spectrometer ͑Jasco CT-25C͒ and a Peltier-device-cooled photomultiplier tube ͑Hamamatsu R375͒. The 325 nm line of a He-Cd laser ͑Kimmon IK3302R-E͒ chopped at 328 Hz was used as the excitation light source. The surface chemistry of the PSi samples was monitored by FTIR spectroscopy....