Fracture of Sn-3.5%Ag solder alloy under creep

Igoshev, V. I.; Kleiman, Jacob; Shangguan, Dongkai; Wong, S.; Michon, U.

doi:10.1007/s11664-000-0119-z

Cited by 20 publications

(11 citation statements)

References 8 publications

(8 reference statements)

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“…The Sn-3.5Ag eutectic solder and its tertiary alloys are among the strongest candidates; however, reports on their creep and fatigue properties are rather rare. [3][4][5][6][7][8][9][10][11] The Sn-3.5Ag alloys have higher melting temperatures, faster growth rates of intermetallic compounds (IMCs), and higher dissolution rate of Cu compared to the Pb-Sn eutectic solder. 12 According to Frear et al, 13 an addition of Cu to the Sn-3.5Ag alloy decreased the dissolution rate of the Cu pad and the growth rate of the IMC.…”

Section: Introductionmentioning

confidence: 99%

Creep rupture of lead-free Sn-3.5Ag-Cu solders

Joo

Shin

2003

Journal of Elec Materi

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Creep-rupture properties of lead-free Sn-3.5Ag-based alloys with varying amount of Cu were investigated using rolled and heat-treated dog-bone-shaped specimens. Nominal compositions of added copper were 0 wt.%, 0.5 wt.%, 0.75 wt.%, 1.0 wt.%, and 1.5 wt.%. During creep tests, the matrix hardness dropped significantly, and the minimum strain rates ( min ) were lowest for the 0.75Cu specimens. The stress exponents (n) of min were usually around 4, with the exception of the 0.5Cu and 0.75Cu alloys, which showed somewhat higher values of n. Fractographic analyses revealed typical creep rupture by the nucleation and growth of cavities in the matrix except the 1.5Cu specimens, which showed cavity nucleation at brittle Cu 6 Sn 5 particles.

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Section: Introductionmentioning

confidence: 99%

Creep rupture of lead-free Sn-3.5Ag-Cu solders

Joo

Shin

2003

Journal of Elec Materi

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“…Joo et al [13] indicated that voids nucleated at the matrix. However, Igoshev et al [14,15] elucidated that micro-crack nucleated at grain boundary by separation along the particle/matrix interface. Considering the solder property is different from the solder joint, the creep rupture of solder joints were also investigated by many researchers.…”

Section: Introductionmentioning

confidence: 99%

Creep failure mechanism and life prediction of lead-free solder joint

Zhu

Gao

2014

J Mater Sci: Mater Electron

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The reliability of solder joints in electronic products has received a lot of concern. The creep behavior is an important property for lead-free solder. In this research, creep tests were conducted to the Sn3.0Ag0.5Cu solder joints. Creep failure mechanism was analyzed and creep life was evaluated based on the Monkman-Grant and Larson-Miller parameter model. The results show that separation is easy to take place at dendrite grain boundaries. Creep cavity initiates at triple junctions of dendrite grains in solder matrix near the intermetallic compound layer. The creep fracture morphology at low temperature and high stress comprises three regions: the shear plane, shear lip and the instantaneous rupture zone. However, the shear plane region is disappeared with increasing the temperature and decreasing the stress. The rupture surface is characterized by the shear lip and inter-granular failure morphology. The Monkman-Grant equation and LarsonMiller parameter model can be used to predict the solder joint creep life.

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“…Indium, which is more stable than copper, is thus considered as the fourth element, since indium is believed to have the effect of suppressing the solder melting temperature. [14][15][16] Accordingly, the current study explores the feasibility of reducing the melting temperature through the addition of small amounts of In and the effect of indium on the microstructural and morphological evolution of Sn-3Ag-2Sb solder. Quaternary Sn-3Ag-2Sb-xIn solder systems were prepared by doping Sn-3Ag-2Sb solder with 1 wt.%, 5 wt.%, and 10 wt.% In, respectively.…”

Section: Introductionmentioning

confidence: 99%

Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions

Lee

et al. 2009

Journal of Elec Materi

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The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints were examined. The results showed that In prompts the formation of Ag 3 (Sn,In), Ag 2 (In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag 3 Sn compound were gradually replaced by In atoms, prompting a transformation from Ag 3 Sn to Ag 3 (Sn,In) and finally to Ag 2 (In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag 2 (In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu 6 Sn 5 interfacial compounds in the solder/Cu joints transformed into Cu 6 (Sn,In) 5 .

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Fracture of Sn-3.5%Ag solder alloy under creep

Cited by 20 publications

References 8 publications

Creep rupture of lead-free Sn-3.5Ag-Cu solders

Creep rupture of lead-free Sn-3.5Ag-Cu solders

Creep failure mechanism and life prediction of lead-free solder joint

Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions

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