2010
DOI: 10.1016/j.diamond.2009.08.017
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Formation and characterization of 4-inch GaN-on-diamond substrates

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Cited by 123 publications
(82 citation statements)
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“…For ultra-high power applications, even SiC substrates can become a thermal bottle neck. Polycrystalline CVD diamond is being developed for GaN ultra-high-power applications to address this [87,88]. For example, GaN-on-diamond thermal models, using material parameters obtained from Raman thermography measurements, have been used to demonstrate that GaN-on-diamond can offer a >3× reduction in thermal resistance when scaled to large devices, with respect to GaN-on-SiC [85].…”
Section: Raman Thermography For Device Optimizationmentioning
confidence: 99%
“…For ultra-high power applications, even SiC substrates can become a thermal bottle neck. Polycrystalline CVD diamond is being developed for GaN ultra-high-power applications to address this [87,88]. For example, GaN-on-diamond thermal models, using material parameters obtained from Raman thermography measurements, have been used to demonstrate that GaN-on-diamond can offer a >3× reduction in thermal resistance when scaled to large devices, with respect to GaN-on-SiC [85].…”
Section: Raman Thermography For Device Optimizationmentioning
confidence: 99%
“…However, managing waste heat is an increasingly important consideration when extending GaN RF HEMT operation to ultra-high-power densities. The heteroepitaxial integration of GaN devices with diamond grown by chemical vapor deposition (CVD), to form GaN-on-diamond, takes advantage of very high thermal conductivity diamond within ~1 µm of where heat is generated in the transistor channel [2]. GaN-on-diamond wafers have been made in diameters up to 100 mm, suitable for commercial wafer processing [2].…”
Section: Introduction Lgan/gan High Electron Mobility Transistors mentioning
confidence: 99%
“…The heteroepitaxial integration of GaN devices with diamond grown by chemical vapor deposition (CVD), to form GaN-on-diamond, takes advantage of very high thermal conductivity diamond within ~1 µm of where heat is generated in the transistor channel [2]. GaN-on-diamond wafers have been made in diameters up to 100 mm, suitable for commercial wafer processing [2]. Excellent electrical and thermal performance has already been demonstrated for RF transistors on GaN-on-diamond wafers [3,4], and 3× higher power densities have been obtained with respect to GaN-on-SiC devices [5].…”
Section: Introduction Lgan/gan High Electron Mobility Transistors mentioning
confidence: 99%
“…Besides investigations on the adding of a diamond layer on existing GaN structures, 4,5 this research involves bonding of GaN on CVD diamond [6][7][8] and the application of siliconon-diamond substrates. 9,10 Recently, GaN has been deposited directly on several types of diamond substrate, [11][12][13][14][15] leading to the successful fabrication of an AlGaN/GaN HEMT on (111) single crystalline diamond by MBE.…”
Section: Introductionmentioning
confidence: 99%