DOI: 10.1115/1.4030382
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Abstract: Heat transfer coefficients in a set of three symmetrically heated narrow gap channels arranged in line are reported at power densities of 1 kW/cm3 and wall heat flux of 3–40 W/cm2. This configuration emulates an electronics system wherein power dissipation can vary across an array of processors, memory chips, or other components. Three pairs of parallel ceramic resistance heaters in a nearly adiabatic housing form the flow passage, and length-to-gap ratios for each pair of heaters are 34 at a gap of 0.36 mm. N…

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