2022
DOI: 10.1016/j.compscitech.2022.109654
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Flexible substrate based on sandwich-structure hydrocarbon resin/aligned boron nitride composites with high thermal conductivity and low dielectric loss

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Cited by 14 publications
(4 citation statements)
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“…Figure 6c presents the infrared thermal images of PI films, intrinsically thermally conductive LC-PI films, ther- The satisfying thermal management of thermally conductive LC-CNT/LC-PI composite films can ensure the operation stability and service life of products and devices. [56,57]…”
Section: Methodsmentioning
confidence: 99%
“…Figure 6c presents the infrared thermal images of PI films, intrinsically thermally conductive LC-PI films, ther- The satisfying thermal management of thermally conductive LC-CNT/LC-PI composite films can ensure the operation stability and service life of products and devices. [56,57]…”
Section: Methodsmentioning
confidence: 99%
“…This facilitates the efficient formation of thermal conduction pathways, bolstering its thermal conductivity with much enhanced effectiveness. [54,55] To this end, hetero-structured AgNWs@BNNS prepared by growing boron nitride nanosheets (BNNS) on the surface of AgNWs via in situ growth method is used as thermally conductive filler in this work, and aramid nanofibers (ANFs), which are widely used in modern military and highend electronic devices, are used as matrix, to fabricate sandwich structured thermally conductive and electrically insulating (BNNS/ANF)-(AgNWs@BNNS)-(BNNS/ANF) (denoted as BAB) composite films by "filtration selfassembly, air spraying, and hot-pressing" method, achieving thermally conductive, electrically insulating, and adaptive camouflage and information encryption functionalities in BAB composite films. Scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS) are performed to analyze and characterize the composition and morphology of BAB composite films.…”
Section: Introductionmentioning
confidence: 99%
“…The in‐plane TC of the film reached 4.00 W/mK at 5 wt% rGO loading due to the PVA‐rGO interlayer. Wang 38 et al prepared hexagonal boron nitride (h‐BN)‐filled highly elastic styrene ethylene butylene‐styrene (SEBS) composites, which were oriented along the in‐plane direction by hot pressing. A sandwich structure was designed using a pure cyclic olefin copolymer (COC) film as the outer surface layer and SEBS/h‐BN as the middle layer.…”
Section: Introductionmentioning
confidence: 99%