2022
DOI: 10.1109/tbme.2021.3115464
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Flexible Hybrid Integration Enabled xsOn-Skin Electronics for Wireless Monitoring of Electrophysiology and Motion

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Cited by 8 publications
(8 citation statements)
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“…Zhao et al [40] fabricated an on-skin FHES with multifunctional sensing functions. As shown in Figure 2(c), the multilayer FHES consisted mainly of conductive components and a wireless flexible printed circuit board (FPCB) for sensing, processing, and transmission.…”
Section: Flexible and Stretchable 3d Interconnectsmentioning
confidence: 99%
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“…Zhao et al [40] fabricated an on-skin FHES with multifunctional sensing functions. As shown in Figure 2(c), the multilayer FHES consisted mainly of conductive components and a wireless flexible printed circuit board (FPCB) for sensing, processing, and transmission.…”
Section: Flexible and Stretchable 3d Interconnectsmentioning
confidence: 99%
“…However, the fabrication process of the current integration scheme is complicated and cannot guarantee the high-density integration of electronic components. In order to overcome these shortcomings, Zhao et al [40] reported a flexible hybrid integration scheme and fabricated an on-skin flexible hybrid electronic system for collecting ECG and acceleration data, as illustrated in Figure 3(c). For integrating discrete electronic components and rigid IC chips on stretchable substrates without limiting the stretchability of the system, a type of silicone-micro silver flakes based ECC was chosen for preparing stretchable interconnects and bonding chips with PDMS substrates.…”
Section: Ic Bonding On Soft Substratementioning
confidence: 99%
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