First microphones based on an in-plane deflecting micro-diaphragm and piezoresistive nano-gauges

Lhermet, H.; Verdot, Thierry; Berthelot, A.; Desloges, B.; Souchon, Frédéric

doi:10.1109/memsys.2018.8346531

Cited by 6 publications

(9 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Another microphone introduced in ref. [133] includes four in-plane moving membranes and suspended Si NWs of 250 Â 250 nm 2 cross-sectional area placed between an anchor [131] Copyright 2018, IEEE. b) A microphone based on thick SOI technology: (i) 3D model of the microphone reveals the positioning of the electrodes, E, vent holes, V, and a close-up view of the embedded Si NW, G, in the membrane, M, (ii) SEM image in top view depicts M with a diameter of 706 μm, and (iii) the close-up SEM image of G reveals a CD of 315 nm and a length of 20.3 μm.…”

Section: Microphonesmentioning

confidence: 99%

“…Figure 6. a) Configuration of a Si NW-based microphone: (i) Schematic of the microphone, including the inlet vent, V, back cavity, B, and a close-up view of the in-plane deflecting beam, D, (ii) SEM image in top view depicts the mechanical structure that comprises D and the electrostatic actuator, E, (iii) close-up SEM image showing details of deflecting beam, D, hinge, H, and Si NW gages, G.Reproduced with permission [131]. Copyright 2018, IEEE.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

et al. 2023

View full text Add to dashboard Cite

The miniaturization of microelectromechanical systems (MEMS) physical sensors is driven by global connectivity needs and is closely linked to emerging digital technologies and the Internet of Things. Strong technical advantages of miniaturization such as improved sensitivity, functionality, and power consumption are accompanied by significant economic benefits due to semiconductor manufacturing. Hence, the trend to produce smaller sensors and their driving force resemble very much those of the miniaturization of integrated circuits (ICs) as described by Moore's law. In this respect, with its IC‐, and MEMS‐compatibility, and scalability, the silicon nanowire is frequently employed in frontier research as the sensor building block replacing conventional sensors. The integration of the silicon nanowire with MEMS has thus generated a multiscale hybrid architecture, where the silicon nanowire serves as the piezoresistive transducer and MEMS provide an interface with external forces, such as inertial or magnetic. This approach has been reported for almost all physical sensor types over the last decade. These sensors are reviewed here with detailed classification. In each case, associated technological challenges and comparisons with conventional counterparts are provided. Future directions and opportunities are highlighted.

show abstract

Section: Microphonesmentioning

confidence: 99%

mentioning

confidence: 99%

Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

et al. 2023

View full text Add to dashboard Cite

show abstract

“…Sound wave pressure from the inlet deflects the microbeams in the plane of the base wafer which induces stress in the nanoguages. Another design with the same sensing mechanism as that of [54] has been proposed in [56] with a measured resonant frequency of 16 kHz. Piezoresistive microphones can be found in applications of fluidic mechanics [57,58] and aeroacoustics [52,59].…”

Section: Piezoresistive Microphonesmentioning

confidence: 99%

Design Approaches of MEMS Microphones for Enhanced Performance

Shah

Lee

et al. 2019

Journal of Sensors

View full text Add to dashboard Cite

This paper reports a review about microelectromechanical system (MEMS) microphones. The focus of this review is to identify the issues in MEMS microphone designs and thoroughly discuss the state-of-the-art solutions that have been presented by the researchers to improve performance. Considerable research work has been carried out in capacitive MEMS microphones, and this field has attracted the research community because these designs have high sensitivity, flat frequency response, and low noise level. A detailed overview of the omnidirectional microphones used in the applications of an audio frequency range has been presented. Since the microphone membrane is made of a thin film, it has residual stress that degrades the microphone performance. An in-depth detailed review of research articles containing solutions to relieve these stresses has been presented. The comparative analysis of fabrication processes of single- and dual-chip omnidirectional microphones, in which the membranes are made up of single-crystal silicon, polysilicon, and silicon nitride, has been done, and articles containing the improved performance in these two fabrication processes have been explained. This review will serve as a starting guide for new researchers in the field of capacitive MEMS microphones.

show abstract

“…In recent years, many researchers have studied MEMS microphones because of their great performance, such as high sensitivities, low power consumption, suitable frequency responses, stability, and reliability, and several MEMS microphones have been developed including capacitance type [2][3][4][5], piezoelectric type [6][7][8][9] and piezoresistive type [10][11][12]. For example, Ganji et al [4] reported a MEMS capacitive microphone using a perforated diaphragm supported by Z-shape arms with a high open sensitivity of 2.46 mV/Pa, and a small size of 0.3 mm × 0.3 mm; Segovia-Fernandez et al [6] reported a MEMS piezoelectric acoustic sensor with a sensitivity of 0.68 mV/Pa; Rahaman et al [7] reported a MEMS piezoelectric acoustic sensor with very high signal-to-noise ratio; Lhermet et al [10] first reported a piezoresistive microphone based on an in-plane deflecting micro-diaphragm and piezoresistive nano-gauges with a small size and high sensitivity of 0.1 mV/Pa. Although those microphones fit well with MEMS technology and provide a good performance, the capacitive microphone has the problem that the capacitive plate is easy to absorb and adhere to [2], and the piezoelectric microphone has the problems of poor anti-interference ability and low signal-to-noise ratio, and the piezoresistive microphone has the problem of low sensitivity [8].…”

Section: Introductionmentioning

confidence: 99%

“…small size of 0.3 mm × 0.3 mm; Segovia-Fernandez et al [6] reported a MEMS piezoelectric acoustic sensor with a sensitivity of 0.68 mV/Pa; Rahaman et al [7] reported a MEMS piezoelectric acoustic sensor with very high signal-to-noise ratio; Lhermet et al [10] first reported a piezoresistive microphone based on an in-plane deflecting micro-diaphragm and piezoresistive nano-gauges with a small size and high sensitivity of 0.1 mV/Pa. Although those microphones fit well with MEMS technology and provide a good performance, the capacitive microphone has the problem that the capacitive plate is easy to absorb and adhere to [2], and the piezoelectric microphone has the problems of poor antiinterference ability and low signal-to-noise ratio, and the piezoresistive microphone has the problem of low sensitivity [8].…”

Section: Introductionmentioning

confidence: 99%

Design and Optimization of a BAW Microphone Sensor

Guo

Liu

et al. 2022

Micromachines

View full text Add to dashboard Cite

A wind tunnel experiment is an important way and effective method to research the generation mechanism of aerodynamic noise and verify aerodynamic noise reduction technology. Acoustic measurement is an important part of wind tunnel experiments, and the microphone is the core device in an aerodynamic acoustic measurement system. Aiming at the problem of low sound pressure (several Pa) and the small measuring surface of an experimental model in a wind tunnel experiment, a microphone sensor head with high sensitivity and small volume, based on film bulk acoustic resonator (FBAR), is presented and optimized in this work. The FBARs used as a transducer are located at the edge of a diaphragm for sound pressure level detection. A multi-scale and multi-physical field coupling analysis model of the microphone is established. To improve the performance of the microphone, the structural design parameters of the FBAR and the diaphragm are optimized by simulation. The research results show that the microphone has a small size, good sensitivity, and linearity. The sensor head size is less than 1 mm × 1 mm, the sensitivity is about 400 Hz/Pa when the sensor worked at the first-order resonance frequency, and the linearity is better than 1%.

show abstract

First microphones based on an in-plane deflecting micro-diaphragm and piezoresistive nano-gauges

Cited by 6 publications

References 4 publications

Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

Design Approaches of MEMS Microphones for Enhanced Performance

Design and Optimization of a BAW Microphone Sensor

Contact Info

Product

Resources

About