Finite element analysis of micro-scale CSP solder joint in 3D packaging under random vibration

Han, Li-shuai; Huang, Chunyue; Yin, Rui; Liang, Ying Chun; Huang, Genxin; Li, Tianming

doi:10.1109/icept.2017.8046533

Cited by 4 publications

(3 citation statements)

References 3 publications

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“…In addition, the effects of vibration loadings on the solder joints of electronic packages were well studied. [15][16][17][18][19] For example, Jang et al 20 investigated the fatigue behavior of dummy solder balls in a solidstate drive under random vibration using a globallocal analysis technique. It was found that the corner of the controller package was the weakest component and, consequently, locating the solder balls on the corner led to an increase in the fatigue life of system.…”

Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the IMechE

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In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading mode was individually analyzed, and then according to the incremental damage superposition approach, the simultaneous effects were thoroughly studied. Under thermal cycling, the creep behavior of the solder is linked to the fatigue life. In fact, the creep accumulated strain in each thermal cycle has a straight relation to the failure time of solder joint. The origin of stress/strain in the assembly is owing to the sharp difference between coefficients of thermal expansions of the components in the electronic package. Regarding the vibration loading, the root mean square of peeling stress as a widely acceptable failure indicator was used to evaluate the vibration effects on the fatigue life. It is determined that the maximum stress is concentrated at the corner of solder layer. This result was similar to the outcomes of thermal cycling. The results also indicated that the combination of thermal and mechanical loadings accelerates the failure of the solder joint of the power MOSFET. Furthermore, the experimental and simulation studies showed similar results and approved the crack initiation at the corner of solder layer.

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Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the IMechE

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show abstract

“…A new fatigue equation with vibration frequency and cracking energy density considerations was proposed by Lee and Jeong (2014) for solder joints. S-N curve dependency of packaging architecture and arrangement was discovered and numerated by Xia et al (2017b) and supported with three-dimensional FEM simulations of micro-scale chip scale package under cyclic mechanical loadings (Han et al, 2017). An FEM-based random vibration model for BGA solder joints fatigue lifetime estimation was proposed by Zarmai et al (2017) and confirmed via experimental random vibration testing.…”

Section: Introductionmentioning

confidence: 75%

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Gao

Wang

Ding

et al. 2020

SSMT

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“…According to the U.S. Air Force AVIP (Avionics Integrity Program), more than 20% of electronic product failures are attributed to vibration and shock, with solder joint failures being the most common [1,2]. Numerous studies have analyzed the stress and lifespan of solder joints in various environments [3,4,5,6,7,8,9,10,11], with most research utilizing the finite element method to evaluate the impact factors and lifespan of solder joints under vibration [12,13,14,15,16,17,18]. Some studies have also focused on parameter optimization for solder joints [19,20,21,22], employing various optimization methods [23,24,25].…”

Section: Introductionmentioning

confidence: 99%

Stress analysis and optimization of pop package under random vibration loading

Zhang,

Zhu,

Lian

et al. 2023

IEICE Electron. Express

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The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimize the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031 MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.

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Finite element analysis of micro-scale CSP solder joint in 3D packaging under random vibration

Cited by 4 publications

References 3 publications

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Stress analysis and optimization of pop package under random vibration loading

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