Factors affecting thermal conductivities of the polymers and polymer composites: A review

Guo, Yue; Ruan, Kunpeng; Shi, Xuetao; Yang, Xin; Gu, Junwei

doi:10.1016/j.compscitech.2020.108134

Cited by 550 publications

(318 citation statements)

References 265 publications

Supporting

Mentioning

267

Contrasting

Unclassified

Order By: Relevance

“…Typically, epoxy resin is used as an insulating material for general electronic devices owing to its moderate flexibility compared to other thermosetting resins, such as phenolic, bismaleimide, and cyanate ester resins. However, its thermal conductivity is very low, typically ~ 0.2 W m −1 K −1 1 . One evident approach to improve the performance of the epoxy resin would be to improve its thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Shimamura

Hotta

Hyuga

et al. 2020

Sci Rep

View full text Add to dashboard Cite

Electrically insulating and thermally conductive polymer matrix composites are desirable for industry applications as they improve the reliability of high-performance electronic devices, particularly via heat dissipation in devices loaded with several electronic components. In this study, an aggregated β-Si3N4 filler with randomly oriented grains was produced via combustion synthesis to improve the thermal conductivity of epoxy composites. The thermal conductivities of the prepared composites were investigated as a function of the filler content, and the values were compared to those of composites loaded with commercial β-Si3N4 (non-aggregated). Negligible difference was observed in the thermal conductivities of both types of composites when the Si3N4 content was below 40 vol%; however, above 40 vol%, the aggregated β-Si3N4 filler-loaded composites showed higher thermal conductivities than the commercial β-Si3N4-loaded composites. The aggregated β-Si3N4 filler-loaded composites exhibited isotropic thermal conductivities with a maximum value of 4.7 W m−1 K−1 at 53 vol% filler content, which is approximately 2.4 times higher than that of the commercial β-Si3N4-loaded composites, thereby suggesting that the morphology of the aggregated filler would be more efficient than that of the commonly used non-aggregated filler in enhancing the thermal conductivity of a polymer matrix composite.

show abstract

Section: Introductionmentioning

confidence: 99%

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Shimamura

Hotta

Hyuga

et al. 2020

Sci Rep

View full text Add to dashboard Cite

show abstract

“…Figure 6 a displays the thermal conductivity variations of the different composites as a function of filler content. In general, for all cases, the thermal conductivity increased with filler loading, and it was noted that the thermal conductivity is affected by the particle size and shape of filler particles [ 1 , 7 , 15 , 19 , 36 , 37 , 40 , 41 , 42 , 43 , 44 ]. The epoxy binder system exhibited a very low thermal conductivity of 0.22 W·m −1 ·K −1 .…”

Section: Resultsmentioning

confidence: 99%

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

et al. 2021

View full text Add to dashboard Cite

In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

show abstract

“…Most polymers have the advantages of good processability, low cost and excellent insulation, etc, but the lower thermal conductivity of polymers (around 0.1-0.3 W m −1 K −1 ) limits the application in the field of thermally conductive packaging [5][6][7]. In order to ensure the great stability and lifetime in practical application of materials, thermally conductive fillers are widely used to improve the thermal conductivity of the composites [8][9][10][11][12]. In this case, to obtain the high thermal conductivity of composites, the increase of filler content will lead to a decrease in the mechanical and processing performance of materials [13].…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

Gao

Shen

Wang

2020

Mater. Res. Express

View full text Add to dashboard Cite

A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO 2 ). Compared to the epoxy (EP) composites with randomly dispersed BN and SiO 2 , the EP/SiO 2 @BN showed a great enhancement in thermal conduction. The thermal conductivity of EP/SiO 2 @BN reached to 0.86 Wm −1 K −1 with 60 wt% content of hybrid filler, which was 91% higher than that of EP/SiO 2 samples and was around 12% higher than that of epoxy composites with unmodified BN and SiO 2 . In addition, the EP/SiO 2 @BN exhibited lower thermal interface resistance in comparison with EP/SiO 2 &BN composites according to the effective medium theory (EMT). The encapsulation of BN on the surface of SiO 2 greatly enhanced the thermal transfer efficiency of the epoxy matrix and showed great potential in the epoxy packaging practical application.

show abstract

Factors affecting thermal conductivities of the polymers and polymer composites: A review

Cited by 550 publications

References 265 publications

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

Contact Info

Product

Resources

About