2020
DOI: 10.1186/s11671-020-3251-0
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Fabrication of High-Quality and Strain-Relaxed GeSn Microdisks by Integrating Selective Epitaxial Growth and Selective Wet Etching Methods

Abstract: GeSn is a promising material for the fabrication of on-chip photonic and nanoelectronic devices. Processing techniques dedicated to GeSn have thus been developed, including epitaxy, annealing, ion implantation, and etching. In this work, suspended, strain-relaxed, and high-quality GeSn microdisks are realized by a new approach without any etching to GeSn alloy. The GeSn alloy was grown on pre-patterned Ge (001) substrate by molecular beam epitaxy at low temperatures. The transmission electron microscopy and sc… Show more

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Cited by 9 publications
(8 citation statements)
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References 38 publications
(48 reference statements)
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“…146 The incorporation of Sn inside the SiGeSn barriers was controlled by the growth temperature of about 300 C. Microdisk cavities were fabricated using photolithography. [147][148][149][150] The PL spectra of MQW were obtained at different temperatures, pumping with a laser of wavelength 1064 nm. A 72 kW cm À2 peak pump power achieve dominant lasing emission at 495 meV.…”
Section: Gesn-based Led Devicesmentioning
confidence: 99%
See 1 more Smart Citation
“…146 The incorporation of Sn inside the SiGeSn barriers was controlled by the growth temperature of about 300 C. Microdisk cavities were fabricated using photolithography. [147][148][149][150] The PL spectra of MQW were obtained at different temperatures, pumping with a laser of wavelength 1064 nm. A 72 kW cm À2 peak pump power achieve dominant lasing emission at 495 meV.…”
Section: Gesn-based Led Devicesmentioning
confidence: 99%
“…Microdisk cavities were fabricated using photolithography. 147–150 The PL spectra of MQW were obtained at different temperatures, pumping with a laser of wavelength 1064 nm. A 72 kW cm −2 peak pump power achieve dominant lasing emission at 495 meV.…”
Section: Introductionmentioning
confidence: 99%
“…The microstructures of Ge1-xSnx samples were studied by transmission and scanning electron microscopes. The results show that defects are mainly localized at the Ge1-xSnx/Ge interface [5].…”
Section: Introductionmentioning
confidence: 95%
“…To avoid the growth defects caused by merely increasing the Sn content, strain engineering was taken to realize the indirect to direct bandgap transition of GeSn alloys [16][17][18]. A significant improvement of the luminous efficiency and wavelength application in the mid-infrared spectra with the tensile stressor [10,19].…”
Section: Introductionmentioning
confidence: 99%