Fabrication and reliability investigation of copper pillar and tapered through silicon via (TSV) for direct bonding in 3D integration

Chang, Yu-Wei; Chen, Kuan‐Neng

doi:10.1109/ipfa.2015.7224427

2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits 2015

DOI: 10.1109/ipfa.2015.7224427

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Fabrication and reliability investigation of copper pillar and tapered through silicon via (TSV) for direct bonding in 3D integration

Yu-Wei Chang

Kuan‐Neng Chen

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Fabrication and reliability investigation of copper pillar and tapered through silicon via (TSV) for direct bonding in 3D integration

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References 5 publications

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