Extremely anisotropic single-crystal growth in nanotwinned copper

Lu, Chia Ling; Lin, Han Wen; Liu, Chien Min; Huang, Yongheng; Lu, Tien Lin; Liu, Tao Chi; Hsiao, Hsiang Yao; Chen, Chih; Kuo, Jui Chao; Tu, K. N.

doi:10.1038/am.2014.90

Cited by 41 publications

(17 citation statements)

References 21 publications

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“…Nanotwinned 111 planes parallel to the substrate surface has been reported 12,17,19,26 . They are observed to exist in columnar fine grains prolonging several micrometers vertical to the substrate, but do not have a preferred direction from the plan view due to grains having other orientations.…”

Section: Resultsmentioning

confidence: 96%

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Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Chiu¹,

Liu²,

Lin³

et al. 2020

Sci Rep

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Fine grained and nanotwinned Au has many excellent properties and is widely used in electronic devices. We have fabricated $$\langle {110} \rangle $$ ⟨ 110 ⟩ preferred-oriented Au thin films by DC plating at 5 mA/cm2. Microstructure analysis of the films show a unique fine grain structure with a twin formation. Hardness tests performed on electroplated $$\langle {110} \rangle $$ ⟨ 110 ⟩ Au films show a hardness 47% greater than random and untwinned Au. We then achieved direct bonding between two Au $$\langle {110} \rangle $$ ⟨ 110 ⟩ surfaces operating at 200 °C for an hour in a vacuum oven. The highly-oriented $$\langle {110} \rangle $$ ⟨ 110 ⟩ nanotwinned Au films could be an ideal material in many gold products.

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Section: Resultsmentioning

confidence: 96%

“…Multiple research report nanotwins in Au nanowires and pulse electroplated Cu films 17 – 19 ; displaying -oriented nanotwins with high hardness and strength compared to bulk Au 2 , 20 . Adding impurities such as Cu or Pt to pure Au could also increase the hardness 21 , 22 .…”

Section: Introductionmentioning

confidence: 99%

Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Chiu¹,

Liu²,

Lin³

et al. 2020

Sci Rep

Self Cite

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show abstract

“…Later, Lu et al. further utilized pulse waveforms to increase the twin density and gain better twinned microstructures . However, some issues still existed.…”

Section: Introductionmentioning

confidence: 99%

Effect of Reverse Currents during Electroplating on the ⟨111⟩-Oriented and Nanotwinned Columnar Grain Growth of Copper Films

Chen

2020

Crystal Growth & Design

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Nanotwinned copper (nt-Cu) has been attracting a great deal of attention in the past decades due to its excellent mechanical and electrical properties. In this study, a new approach, periodic-reverse (PR) waveforms, is adopted to electroplate nt-Cu films with highly ⟨111⟩ oriented columnar grain microstructures. We investigate the effect of the reverse current on the microstructures of ⟨111⟩-oriented nt-Cu films and their grain growth behavior. With proper reverse current parameters, we are able to obtain a nt-Cu film with a significantly thin transition layer, low amount of impurities, and low residual stress levels in comparison to a DC electroplated film. It is also discovered that the grain size after annealing of the nt-Cu film is related to its initial columnar grain microstructures, which can be tailored by the reverse current parameter. These results show that PR electroplating provides a promising approach in improving and controlling the microstructures and properties of nt-Cu films.

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“…Generally, the grain size after growth is approximately equal to the thickness of the metal film. However, films with abnormal grain growth may have a giant grain growth up to several hundred micrometers, in materials such as aluminum, , silver, , and Cu. − …”

Section: Introductionmentioning

confidence: 99%

Fabrication and Characterization of ⟨100⟩-Oriented Quasi-single Crystalline Cu Lines

Chen

2020

Crystal Growth & Design

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Nanotwinned copper (nt-Cu) films with ⟨111⟩ crystal orientation were electroplated on Si wafers by pulse plating, with original grain size of ∼1.4 μm. By patterning and annealing the nt-Cu film at 450–500 °C for 1 h, we can grow a large number of ⟨100⟩-oriented quasi-single crystal Cu lines that are 200 and 500 μm in length and 60 μm in width. We perform anisotropic grain growth on a Si substrate to fabricate quasi-single crystal Cu lines array of ⟨100⟩ crystal orientation. These large ⟨100⟩ Cu single crystals may have potential applications as interconnects in three-dimensional integrated circuit technology.

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Extremely anisotropic single-crystal growth in nanotwinned copper

Cited by 41 publications

References 21 publications

Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Effect of Reverse Currents during Electroplating on the ⟨111⟩-Oriented and Nanotwinned Columnar Grain Growth of Copper Films

Fabrication and Characterization of ⟨100⟩-Oriented Quasi-single Crystalline Cu Lines

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