2011
DOI: 10.4028/www.scientific.net/kem.474-476.880
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Abstract: In order to verify whether a new kind heat pipe heat sink can meet the requirement of high energy chip cooling or not, an experiment was conducted under heating and cooling process with a constant airflow rate. The transient heat exchange rate and transient temperature response of four thermocouples mounted on the upwind surface of the heat sink condenser were obtained. Results show that heat resistance decreases with increase in heat transfer rate under heating process, and the heat resistance is about 0.22K/…

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