MRS Proc. 1998 DOI: 10.1557/proc-515-15 View full text
Xiang Dai, Mark V. Brillhart, Paul S. Ho

Abstract: ABSTRACTIn this paper, we report recent studies on interface adhesion in flip-chip packaging. The adhesion energies of underfill interfaces found in typical flip-chip packaging pplications are characterized and presented using a racture-mechanics approach. The effects of underfill formulations and changes in polymer top-layer on PCB and chip passivation are also evaluated. The effects of underfill organosilane content, ubstrate surface chemistry and morphology, and underfill filler content are discussed in ter…

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